TXS0104E-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to +125°C ambient operating temperature range
- Device HBM ESD Classification Level 2
- Device CDM ESD Classification Level C6
- No direction-control signal required
- Maximum data rates:
- 24 Mbps maximum (push pull)
- 2 Mbps (open drain)
- 1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on B port (V CCA ≤ V CCB)
- No power-supply sequencing required—V CCA or V CCB can be ramped first
- ESD protection exceeds JESD 22:
- A Port
- 2000-V Human-Body Model (A114-B)
- 1000-V Charged-Device Model (C101)
- B Port
- 15-kV Human-Body Model (A114-B)
- 1000-V Charged-Device Model (C101)
- A Port
- IEC 61000-4-2 ESD (B port)
- ±8-kV Contact Discharge
- ±10-kV Air-Gap Discharge
The TXS0104E-Q1 device connects an incompatible logic communication from chip-to-chip due to voltage mismatch. This auto-direction translator can be conveniently used to bridge the gap without the need of direction control from the host. Each channel can be mixed and matched with different output types (open-drain or push-pull) and mixed data flows (transmit or receive) without intervention from the host. This 4-bit noninverting translator uses two separate configurable power-supply rails. The A and B ports are designed to track V CCA and V CCB respectively. The V CCB pin accepts any supply voltage from 2.3 V to 5.5 V while the V CCA pin accepts any supply voltage from 1.65 V to 3.6 V such that V CCA is less than or equal to V CCB. This tracking allows for low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
The TXS0104E-Q1 device is designed so that the OE input circuit is supplied by V CCA.
To be in the high-impedance state during power up or power down, the OE pin must be tied to the GND pin through a pull down resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
기술 자료
설계 및 개발
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14-24-LOGIC-EVM — 14핀~24핀 D, DB, DGV, DW, DYY, NS 및 PW 패키지용 로직 제품 일반 평가 모듈
14-24-LOGIC-EVM 평가 모듈(EVM)은 14핀~24핀 D, DW, DB, NS, PW, DYY 또는 DGV 패키지에 있는 모든 로직 장치를 지원하도록 설계되었습니다.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
TSSOP (PW) | 14 | Ultra Librarian |
UQFN (RUT) | 12 | Ultra Librarian |
WQFN (BQA) | 14 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치