TXS0206-29
- Level Translator
- VCCA Range of 1.1 V to 3.6 V
- Fast Propagation Delay (4 ns Max When
Translating Between 1.8 V and 2.9 V)
- Low-Dropout (LDO) Regulator
- 200-mA LDO Regulator With Enable
- 2.9-V Output Voltage
- 3.05-V to 5.5-V Input Voltage Range
- Very Low Dropout: 200 mV at 200 mA
- ESD Protection Exceeds JESD 22 (A Port)
- 2000-V Human-Body Model (A114-B)
- 1000-V Charged-Device Model (C101)
- ±8-kV Contact Discharge IEC 61000-4-2 ESD (B Port)
All other trademarks are the property of their respective owners.
The TXS0206-29 is a complete solution for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards. It is comprised of a high-speed level translator, a low-dropout (LDO) voltage regulator, IEC level ESD protection, and EMI filtering circuitry.
The voltage-level translator has two supply voltage pins. VCCA can be operated over the full range of 1.1 V to 3.6 V. VCCB is set at 2.9 V and is supplied by an internal LDO. The integrated LDO accepts input voltages from 3.05 V to as high as 5.5 V and outputs 2.9 V, 200 mA to the B-side circuitry and to the external memory card. The TXS0206-29 enables system designers to easily interface low-voltage microprocessors to memory cards operating at 2.9 V.
Memory card standards recommend high-ESD protection for devices that connect directly to the external memory card. To meet this need, the TXS0206-29 incorporates ±8-kV Contact Discharge protection on the card side.
Since memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206-29 an ideal choice for these applications. The TXS0206-29 is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TXS0206-29 MMC, SD Card, Memory Stick(TM) Voltage-Translation Transceiver datasheet | 2009/12/02 | |
Application note | Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators | PDF | HTML | 2024/07/12 | |
Application note | Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) | PDF | HTML | 2024/07/03 | |
Selection guide | Voltage Translation Buying Guide (Rev. A) | 2021/04/15 | ||
Application note | Translate Voltages for SDIO | PDF | HTML | 2020/10/20 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
DSBGA (YFP) | 20 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치