TXS0206A
- Level Translator
- VCCA and VCCB Range of 1.1 V to 3.6 V
- Fast Propagation Delay (4.4 ns Maximum
When Translating Between 1.8 V and 3 V)
- ESD Protection Exceeds JESD 22
- 2500-V Human-Body Model (A114-B)
- 250-V Machine Model (A115-A)
- 1500-V Charged-Device Model (C101)
The TXS0206A is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards.
The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full range of 1.1 V to 3.6 V. The TXS0206A enables system designers to easily interface applications processors or digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level.
The TXS0206A is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206A an ideal choice for these applications.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TXS0206A SD Card Voltage-Translation Transceiver datasheet (Rev. B) | PDF | HTML | 2016/01/20 |
| Application note | Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators | PDF | HTML | 2024/07/12 | |
| Application note | Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) | PDF | HTML | 2024/07/03 | |
| Selection guide | Voltage Translation Buying Guide (Rev. A) | 2021/04/15 | ||
| EVM User's guide | TXS0206 Evaluation Module | 2012/05/08 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TXS0206AEVM — TXS0206A 평가 모듈
The TXS0206A EVM was created to allow simplified evaluation and prototyping without the need for full board development. This EVM provides peripheral header style pads for probing and signal connection to each device pin.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| DSBGA (YFP) | 20 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치