現在提供此產品的更新版本
可直接投入的替代產品,相較於所比較的裝置,具備升級功能
LMC7215-Q1
- Ultra Low Power Consumption 0.7 μA
- Wide Range of Supply Voltages 2V to 8V
- Input Common-Mode Range Beyond V+ and V−
- Open Collector and Push-Pull Output
- High Output Current Drive: (@ VS = 5V) 45 mA
- Propagation Delay (@ VS = 5V, 10 mV Overdrive) 25 μs
- Tiny 5-Pin SOT-23 Package
- Latch-up Resistance >300 mA
- LMC7215-Q1 is an Automotive Grade Product that is AEC-Q100 Grade 3 Qualified.
(Typical Unless Otherwise Noted)
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The LMC7215/LMC7215-Q1/LMC7225 are ultra low power comparators with a maximum of 1 μA power supply current. They are designed to operate over a wide range of supply voltages, from 2V to 8V.
The LMC7215/LMC7215-Q1/LMC7225 have a greater than rail-to-rail common mode voltage range. This is a real advantage in single supply applications.
The LMC7215 features a push-pull output stage. This feature allows operation with absolute minimum amount of power consumption when driving any load.
The LMC7225 features an open drain output. By connecting an external resistor, the output of the comparator can be used as a level shifter to any desired voltage to as high as 15V.
The LMC7215/LMC7215-Q1/LMC7225 are designed for systems where low power consumption is the critical parameter.
Ensured operation over the full supply voltage range of 2.7V to 5V and rail-to-rail performance makes this comparator ideal for battery-powered applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LMC7215/25 Micro-Power, R-to-R CMOS Comp w/Push-Pull/Open-Drain Outputs datasheet (Rev. E) | 2013年 3月 22日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點