38-pin (DBT) package image

MSP430FR2355TDBTR 現行

具有 32-KB FRAM、運算放大器/PGA、12 位元 DAC、12 位元 ADC 的 24-MHz 105-C 整合式類比微控制器

現行 custom-reels 客製 可提供客製捲盤
open-in-new 檢視替代方案

定價

數量 價格
+

額外包裝數量 | 包裝類型選項 這些產品完全相同,但包裝類型不同

MSP430FR2355TDBT 現行
包裝數量 | 運送業者 50 | TUBE
庫存
數量 | 價格 1ku | +

品質資訊

等級 Catalog
RoHS
REACH
引腳鍍層 / 焊球材質 NIPDAU
MSL 等級 / 迴焊峰值 Level-2-260C-1 YEAR
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:EAR99

封裝資訊

封裝 | 針腳 TSSOP (DBT) | 38
操作溫度範圍 (°C) -40 to 105
包裝數量 | 運送業者 2,000 | LARGE T&R

MSP430FR2355 的特色

  • Embedded microcontroller
    • 16-bit RISC architecture up to 24 MHz
    • Extended temperature: –40°C to 105°C
    • Wide supply voltage range from 3.6 V down to 1.8 V (operational voltage is restricted by SVS levels, see VSVSH- and VSVSH+ in PMM, SVS and BOR)
  • Optimized low-power modes (at 3 V)
    • Active mode: 142 µA/MHz
    • Standby:
      • LPM3 with 32768-Hz crystal: 1.43 µA (with SVS enabled)
      • LPM3.5 with 32768-Hz crystal: 620 nA (with SVS enabled)
    • Shutdown (LPM4.5): 42 nA (with SVS disabled)
  • Low-power ferroelectric RAM (FRAM)
    • Up to 32KB of nonvolatile memory
    • Built-in error correction code (ECC)
    • Configurable write protection
    • Unified memory of program, constants, and storage
    • 1015 write cycle endurance
    • Radiation resistant and nonmagnetic
  • Ease of use
    • 20KB ROM library includes driver libraries and FFT libraries
  • High-performance analog
    • One 12-channel 12-bit analog-to-digital converter (ADC)
      • Internal shared reference (1.5, 2.0, or 2.5 V)
      • Sample-and-hold 200 ksps
    • Two enhanced comparators (eCOMP)
      • Integrated 6-bit digital-to-analog converter (DAC) as reference voltage
      • Programmable hysteresis
      • Configurable high-power and low-power modes
      • One with fast 100-ns response time
      • One with 1-µs response time with 1.5-µA low power
    • Four smart analog combo (SAC-L3) (MSP430FR235x devices only)
      • Supports General-Purpose Operational Amplifier (OA)
      • Rail-to-rail input and output
      • Multiple input selections
      • Configurable high-power and low-power modes
      • Configurable PGA mode supports
        • Noninverting mode: ×1, ×2, ×3, ×5, ×9, ×17, ×26, ×33
        • Inverting mode: ×1, ×2, ×4, ×8, ×16, ×25, ×32
      • Built-in 12-bit reference DAC for offset and bias settings
      • 12-bit voltage DAC mode with optional references
  • Intelligent digital peripherals
    • Three 16-bit timers with three capture/compare registers each (Timer_B3)
    • One 16-bit timer with seven capture/compare registers each (Timer_B7)
    • One 16-bit counter-only real-time clock counter (RTC)
    • 16-bit cyclic redundancy checker (CRC)
    • Interrupt compare controller (ICC) enabling nested hardware interrupts
    • 32-bit hardware multiplier (MPY32)
    • Manchester codec (MFM)
  • Enhanced serial communications
    • Two enhanced USCI_A (eUSCI_A) modules support UART, IrDA, and SPI
    • Two enhanced USCI_B (eUSCI_B) modules support SPI and I2C
  • Clock system (CS)
    • On-chip 32-kHz RC oscillator (REFO)
    • On-chip 24-MHz digitally controlled oscillator (DCO) with frequency locked loop (FLL)
      • ±1% accuracy with on-chip reference at room temperature
    • On-chip very low-frequency 10-kHz oscillator (VLO)
    • On-chip high-frequency modulation oscillator (MODOSC)
    • External 32-kHz crystal oscillator (LFXT)
    • External high-frequency crystal oscillator up to 24 MHz (HFXT)
    • Programmable MCLK prescaler of 1 to 128
    • SMCLK derived from MCLK with programmable prescaler of 1, 2, 4, or 8
  • General input/output and pin functionality
    • 44 I/Os on 48-pin package
    • 32 interrupt pins (P1, P2, P3, and P4) can wake MCU from LPMs
  • Development tools and software (also see Tools and Software)
  • Family members (also see Device Comparison)
    • MSP430FR2355: 32KB of program FRAM, 512 bytes of data FRAM, 4KB of RAM
    • MSP430FR2353: 16KB of program FRAM, 512 bytes of data FRAM, 2KB of RAM
    • MSP430FR2155: 32KB of program FRAM, 512 bytes of data FRAM, 4KB of RAM
    • MSP430FR2153: 16KB of program FRAM, 512 bytes of data FRAM, 2KB of RAM
  • Package options
    • 48-pin: LQFP (PT)
    • 40-pin: VQFN (RHA)
    • 38-pin: TSSOP (DBT)
    • 32-pin: VQFN (RSM)

MSP430FR2355 的說明

MSP430FR215x and MSP430FR235x microcontrollers (MCUs) are part of the MSP430™ MCU value line portfolio of ultra-low-power low-cost devices for sensing and measurement applications. MSP430FR235x MCUs integrate four configurable signal-chain modules called smart analog combos, each of which can be used as a 12-bit DAC or a configurable programmable-gain Op-Amp to meet the specific needs of a system while reducing the BOM and PCB size. The device also includes a 12-bit SAR ADC and two comparators. The MSP430FR215x and MSP430FR235x MCUs all support an extended temperature range from –40° up to 105°C, so higher temperature industrial applications can benefit from the devices’ FRAM data-logging capabilities. The extended temperature range allows developers to meet requirements of applications such as smoke detectors, sensor transmitters, and circuit breakers.

The MSP430FR215x and MSP430FR235x MCUs feature a powerful 16-bit RISC CPU, 16-bit registers, and a constant generator that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows the device to wake up from low-power modes to active mode typically in less than 10 µs.

The MSP430 ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing system designers to increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatile behavior of flash.

MSP430FR215x and MSP430FR235x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include the MSP-EXP430FR2355 LaunchPad™ development kit and the MSP-TS430PT48 48-pin target development board. TI also provides free MSP430Ware™ software, which is available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer. The MSP430 MCUs are also supported by extensive online collateral, training, and online support through the E2E™ support forums.

For complete module descriptions, see the MSP430FR4xx and MSP430FR2xx Family User’s Guide.

定價

數量 價格
+

額外包裝數量 | 包裝類型選項 這些產品完全相同,但包裝類型不同

MSP430FR2355TDBT 現行
包裝數量 | 運送業者 50 | TUBE
庫存
數量 | 價格 1ku | +

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解