產品詳細資料

PGA/VGA PGA Number of channels 2 Vs (min) (V) 2.7 Vs (max) (V) 5.5 Interface type UART Noise at 1 kHz (typ) (V√Hz) 0.00000005 Slew rate (typ) (V/µs) 0.6 Rating Automotive Operating temperature range (°C) -40 to 125
PGA/VGA PGA Number of channels 2 Vs (min) (V) 2.7 Vs (max) (V) 5.5 Interface type UART Noise at 1 kHz (typ) (V√Hz) 0.00000005 Slew rate (typ) (V/µs) 0.6 Rating Automotive Operating temperature range (°C) -40 to 125
VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • Qualified for Automotive Applications
  • AEC-Q100 Qualified with the following results
    • Device Temperature Grade 1: -40°C to +125°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level H2
    • Device CDM ESD Classification Level C3B
  • Digital Calibration for Bridge Sensors
  • Offset Select: Coarse and Fine
  • Gain Select: Coarse and Fine
  • Bridge Fault Monitor
  • Input Mux for Lead Swap
  • Over/Under Scale Limits
  • DOUT/ VOUT Clamp Function
  • Seven Banks OTP Memory
  • One-Wire Digital UART Interface
  • Operating Voltage: +2.7V to +5.5V
  • MSOP-10 and 3mm × 4mm DFN-10 Packages
  • Qualified for Automotive Applications
  • AEC-Q100 Qualified with the following results
    • Device Temperature Grade 1: -40°C to +125°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level H2
    • Device CDM ESD Classification Level C3B
  • Digital Calibration for Bridge Sensors
  • Offset Select: Coarse and Fine
  • Gain Select: Coarse and Fine
  • Bridge Fault Monitor
  • Input Mux for Lead Swap
  • Over/Under Scale Limits
  • DOUT/ VOUT Clamp Function
  • Seven Banks OTP Memory
  • One-Wire Digital UART Interface
  • Operating Voltage: +2.7V to +5.5V
  • MSOP-10 and 3mm × 4mm DFN-10 Packages

The PGA308-Q1 is a programmable analog sensor signal conditioner. The analog signal path amplifies the sensor signal and provides digital calibration for offset and gain. Calibration is done via the 1W pin, a digital One-Wire, UART-compatible interface. For three-terminal sensor modules, 1W may be connected to VOUT and the assembly programmed through the VOUT pin. Gain and offset calibration parameters are stored onboard in seven banks of one-time programmable (OTP) memory. The power-on reset (POR) OTP bank may be programmed a total of four times.

The all-analog signal path contains a 2×2 input multiplexer (mux) to allow electronic sensor lead swapping, a coarse offset adjust, an auto-zero programmable gain instrumentation amplifier (PGA), a fine gain adjust, a fine offset adjust, and a programmable gain output amplifier. Fault monitor circuitry detects and signals sensor burnout, overload, and system fault conditions. Over/under-scale limits provide additional means for system level diagnostics. The dual-use DOUT/VCLAMP pin can be used as a programmable digital output or as a VOUT over-voltage clamp.

For detailed application information, see the PGA308 User's Guide (SBOU069) available for download at www.ti.com.

The PGA308-Q1 is a programmable analog sensor signal conditioner. The analog signal path amplifies the sensor signal and provides digital calibration for offset and gain. Calibration is done via the 1W pin, a digital One-Wire, UART-compatible interface. For three-terminal sensor modules, 1W may be connected to VOUT and the assembly programmed through the VOUT pin. Gain and offset calibration parameters are stored onboard in seven banks of one-time programmable (OTP) memory. The power-on reset (POR) OTP bank may be programmed a total of four times.

The all-analog signal path contains a 2×2 input multiplexer (mux) to allow electronic sensor lead swapping, a coarse offset adjust, an auto-zero programmable gain instrumentation amplifier (PGA), a fine gain adjust, a fine offset adjust, and a programmable gain output amplifier. Fault monitor circuitry detects and signals sensor burnout, overload, and system fault conditions. Over/under-scale limits provide additional means for system level diagnostics. The dual-use DOUT/VCLAMP pin can be used as a programmable digital output or as a VOUT over-voltage clamp.

For detailed application information, see the PGA308 User's Guide (SBOU069) available for download at www.ti.com.

下載 觀看有字幕稿的影片 影片

您可能會感興趣的類似產品

open-in-new 比較替代產品
功能相同,但引腳輸出與所比較的裝置不同
PGA113 現行 具 2 通道多工器的零漂移、100-µV 偏移、12-nV/√Hz 雜訊、RRO (範圍增益) 可編程增益放大器 Industrial alternative. This device also offers zero drift at a lower gain (42 dB).

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 1
類型 標題 日期
* Data sheet Single Supply, Auto-Zero Sensor Amplifier with Programmable Gain and Offset datasheet (Rev. A) 2012年 4月 29日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

MULTI-CAL-SYSTEM — Multi-Cal-System 基礎入門套件

The Multi-Cal-System is a system of evaluation modules and accessories that can be used to calibrate multiple PGA308 sensor modules. The Multi-Cal-System can be configured to calibrate from 8 to 64 PGA308s simultaneously. The key component of the Multi-Cal-System is the Multi-Cal-System Starter (...)

使用指南: PDF
TI.com 無法提供
開發板

PGA308EVM — PGA308 評估模組

The PGA308EVM key hardware consists of two boards, PGA308 Test Board and USB DAQ Platform. The PGA308 Test Board contains the PGA308, terminal strips for external connections, several jumpers for device configuration, and support circuitry. The PGA308 Test Board can be used to fully test your (...)

使用指南: PDF
TI.com 無法提供
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
模擬工具

TINA-TI — 基於 SPICE 的類比模擬程式

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
VSSOP (DGS) 10 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片