THS4522
- Fully Differential Architecture
- Bandwidth: 145 MHz (AV = 1 V/V)
- Slew Rate: 490 V/µs
- HD2: –133 dBc at 10 kHz (1 VRMS,
RL = 1 kΩ) - HD3: –141 dBc at 10 kHz (1 VRMS,
RL = 1 kΩ) - Input Voltage Noise: 4.6 nV/√Hz
(f = 100 kHz) - THD+N: –112dBc (0.00025%) at
1 kHz (22-kHz BW, G = 1, 5 VPP) - Open-Loop Gain: 119 dB (DC)
- NRI–Negative Rail Input
- RRO–Rail-to-Rail Output
- Output Common-Mode Control
(with Low Offset) - Power Supply:
- Voltage: +2.5 V (±1.25 V) to
+5.5 V (±2.75 V) - Current: 1.14 mA/ch
- Voltage: +2.5 V (±1.25 V) to
- Power-Down Capability: 20 µA (typical)
The THS4521, THS4522, and THS4524 family of devices are very low-power, fully differential amplifiers with rail-to-rail output and an input common-mode range that includes the negative rail. These amplifiers are designed for low-power data acquisition systems and high-density applications where power dissipation is a critical parameter, and provide exceptional performance in audio applications.
The family includes single FDA (THS4521), dual FDA (THS4522), and quad FDA (THS4524) versions.
These fully differential amplifiers feature accurate output common-mode control that allows for dc-coupling when driving analog-to-digital converters (ADCs). This control, coupled with an input common-mode range below the negative rail as well as rail-to-rail output, allows for easy interfacing between single-ended, ground-referenced signal sources. Additionally, these devices are ideally suited for driving both successive-approximation register (SAR) and delta-sigma (ΔΣ) ADCs using only a single +2.5V to +5V and ground power supply.
The THS4521, THS4522, and THS4524 family of fully differential amplifiers is characterized for operation over the full industrial temperature range from –40°C to +85°C.
技術文件
設計與開發
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THS4522EVM — THS4522 評估模組
The THS4522EVM is an evaluation module for the dual, THS4522 in the PW (16-lead TSSOP) package.
The THS4522EVM is designed to quickly and easily demonstrate the functionality and versatility of the amplifier. The EVM is ready to connect to power, signal source, and test instruments through the use (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點