TLC352
- Single- or Dual-Supply Operation
- Wide Range of Supply Voltages
1.5 V to 18 V - Very Low Supply Current Drain
150 uA Typ at 5 V
65 uA Typ at 1.4 V - Built-In ESD Protection
- High Input Impedance ...1012 Typ
- Extremely Low Input Bias Current 5 pA Typ
- Ultrastable Low Input Offset Voltage
- Input Offset Voltage Change at Worst-Case Input Conditions Typically 0.23 uV/ Month, Including the First 30 Days
- Common-Mode Input Voltage Range Includes Ground
- Outputs Compatible With TTL, MOS, and CMOS
- Pin-Compatible With LM393
LinCMOS is a trademark of Texas Instruments Incorporated.
This device is fabricated using LinCMOS technology and consists of two independent voltage comparators, each designed to operate from a single power supply. Operation from dual supplies is also possible if the difference between the two supplies is 1.4 V to 18 V. Each device features extremely high input impedance (typically greater than 1012 ), which allows direct interface to high-impedance sources. The output are n-channel open-drain configurations and can be connected to achieve positive-logic wired-AND relationships. The capability of the TLC352 to operate from 1.4-V supply makes this device ideal for low-voltage battery applications.
The TLC352 has internal electrostatic discharge (ESD) protection circuits and has been classified with a 2000-V ESD rating tested under MIL-STD-883C, Method 3015. However, care should be exercised in handling this device as exposure to ESD may result in degradation of the device parametric performance.
The TLC352C is characterized for operation from 0°C to 70°C. The TLC352I is characterized for operation over the industrial temperature range of 40°C to 85°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LinCMOS Dual Differential Comparator datasheet (Rev. A) | 2002年 9月 6日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
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AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
PDIP (P) | 8 | Ultra Librarian |
SOIC (D) | 8 | Ultra Librarian |
TSSOP (PW) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。