現在提供此產品的更新版本
可直接投入的替代產品,相較於所比較的裝置,具備升級功能
TLC393-Q1
- Qualified for Automotive Applications
- AEC Q100 Qualified with the Following Results:
- Device Temperature Grade 1: –40°C to 125°C
Ambient Operating Temperature Range - Device HBM ESD Classification Level H2
- Device CDM ESD Classification Level C4B
- Device Temperature Grade 1: –40°C to 125°C
- ESD Protection Exceeds 500 V Per
MIL-STD-883, Method 3015; Exceeds 50 V
Using Machine Model (C = 200 pF, R = 0) - Low Power: 110 µW Typ at 5 V
- Fast Response Time: tPLH = 2.5 µs Typ With
5-mV Overdrive - Single Supply Operation:
- TLC393Q: 4 V to 16 V
The TLC393 consists of dual independent micropower voltage comparators designed to operate from a single supply. It is functionally similar to the LM393 but uses one-twentieth the power for similar response times. The open-drain MOS output stage interfaces to a variety of loads and supplies. For a similar device with a push-pull output configuration see the TLC3702 data sheet.
Texas Instruments LinCMOS process offers superior analog performance to standard CMOS processes. Along with the standard CMOS advantages of low power without sacrificing speed, high input impedance, and low bias currents, the LinCMOS™ process offers extremely stable input offset voltages, even with differential input stresses of several volts. This characteristic makes it possible to build reliable CMOS comparators.
The TLC393Q is characterized for operation over the full automotive temperature range of TA = −40°C to 125°C
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Dual Micropower LinCMOS Voltage Comparator datasheet (Rev. B) | 2013年 5月 20日 | |
Functional safety information | TLC393-Q1 Functional Safety FIT Rate, Failure Mode Distribution | 2020年 2月 25日 | ||
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。