TLV1391
- Low-Voltage and Single-Supply Operation VCC = 2 V to 7 V
- Common-Mode Voltage Range Includes Ground
- Fast Response Time . . . 0.7 µs Typ
- Low Supply Current ...80 µA Typ and 150 µA Max
- Fully Specified at 3-V and 5-V Supply Voltages
The TLV1391 is a differential comparator built using a Texas Instruments low-voltage, high-speed bipolar process. These devices have been developed specifically for low-voltage, single-supply applications. Their enhanced performance makes them excellent replacements for the LM393 in the improved 3-V and 5-V system designs.
The TLV1391, with its typical supply current of only 80 µA, is ideal for low-power systems. Response time also has been improved to 0.7 µs.
技術文件
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檢視所有 2 類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Single Differential Comparators datasheet (Rev. F) | 2007年 6月 27日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
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開發板
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。