TLV3511-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to 125°C ambient operating temperature range
- Device HBM ESD classification level H1C
- Device CDM ESD classification level C6
-
Propagation delay: 7ns
-
High toggle frequency: 180MHz
-
Wide supply range: 2.7V to 5.5V
-
Input offset voltage: +/- 1mV typ.
- Low supply current: 1.1mA per channel
- Input voltage range extends 300mV beyond either rail
-
Internal hysteresis: 2mV
- Power-on-reset provides a known startup condition
- Push-pull output
The TLV351x-Q1 is a family of 5V single and dual channel comparators with push-pull outputs. The family has an excellent speed-to-power combination with a propagation delay of 7ns and a full supply voltage range of 2.7V to 5.5V with a quiescent supply current of only 1mA per channel.
Likewise, the TLV351x-Q1 are conveniently available in standard leaded and leadless packages with features such as rail-to-rail inputs, low offset voltage, and large output drive current. These features along with fast response time make the comparators well-suited for current sensing, zero-cross detection, and a variety of other applications where precision and speed is critical.
All devices are specified for operation across the expanded temperature range of –40°C to 125°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV3511 -Q1 7ns High-Speed Comparator with Rail-to-Rail Input datasheet | PDF | HTML | 2024年 11月 26日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
TLV3601EVM — 具推拉式輸出的 TLV3601 評估模組高速比較器
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-SC70 (DCK) | 5 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點