TLV3702-Q1
- Qualified for Automotive Applications
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Low Supply Current ...560 nA/Per Channel
- Input Common-Mode Range Exceeds the Rails ...–0.1 V to VCC + 5 V
- Supply Voltage Range ...2.7 V to 16 V
- Reverse Battery Protection Up to 18 V
- Push-Pull CMOS Output Stage
- Specified Temperature Range
- –40°C to 125°C - Automotive Grade
- Ultrasmall Packaging
- 5-Pin SOT-23 (TLV3701)
- Universal Op-Amp EVM (Reference SLOU060 for more information)
- APPLICATIONS
- Low Power Automotive Systems
- Security Detection Systems
The TLV370x is Texas Instruments first family of nanopower comparators with only 560 nA per channel supply current, which make this device ideal for low power applications.
The TLV370x has a minimum operating supply voltage of 2.7 V over the extended temperature range
(TA = 40°C to 125°C), while having an input common-mode range of 0.1 to VCC + 5 V. The low supply current makes it an ideal choice for low power applications where quiescent current is the primary concern. Reverse battery protection guards the amplifier from an over-current condition due to improper battery installation. For harsh environments, the inputs can be taken 5 V above the positive supply rail without damage to the device.
Devices are available in SOIC with the singles in the small SOT-23 package. Other package options may be made available upon request.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV370x-Q1 Nanopower Push-Pull Output Comparators datasheet (Rev. E) | 2010年 5月 14日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。