TLV7211A
- Parameters Specified at 2.7-V, 5-V, and 15-V Supplies
- Supply Current 7 µA (Typ) at 5 V
- Response Time 4 µs (Typ) at 5 V
- Push-Pull Output
- Input Common-Mode Range Beyond VCC- and VCC+
- Low Input Current
- APPLICATIONS
- Battery-Powered Products
- Notebooks and PDAs
- Mobile Communications
- Alarm and Security Circuits
- Direct Sensor Interface
- Replaces Amplifiers Used as Comparators With Better Performance and Lower Current
The TLV7211 and TLV7211A are micropower CMOS comparators available in the space-saving SOT-23-5 package. This makes the comparators ideal for space- and weight-critical designs. The TLV7211A features an input offset voltage of 5 mV, and the TLV7211 features an input offset voltage of 15 mV.
The main benefits of the SOT-23-5 package are most apparent in small portable electronic devices, such as mobile phones, pagers, notebook computers, personal digital assistants, and PCMCIA cards. The rail-to-rail input voltage makes the TLV7211 or TLV7211A a good choice for sensor interfacing, such as light detector circuits, optical and magnetic sensors, and alarm and status circuits.
The SOT-23-5 package's small size allows it to fit into tight spaces on PC boards.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV7211, TLV7211A CMOS Comparators With Rail-to-Rail Input and Push-Pull Output datasheet (Rev. B) | 2007年 1月 25日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
SOT-23 (DBV) | 5 | Ultra Librarian |
SOT-SC70 (DCK) | 6 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。