SLVAEZ0 November   2020 TPS1H000-Q1 , TPS1H100-Q1 , TPS1H200A-Q1 , TPS1HA08-Q1 , TPS1HB35-Q1 , TPS2H000-Q1 , TPS2H160-Q1 , TPS2HB16-Q1 , TPS2HB50-Q1 , TPS4H000-Q1 , TPS4H160-Q1

 

  1.   Trademarks
  2. 1Background
    1. 1.1 High-Side Switch
    2. 1.2 Thermal Modeling Using Electrical Analysis
    3. 1.3 Varying RDSON
  3. 2Using TI's SPICE Models With Incorporated Thermal Behavior
    1. 2.1 Basics of PSpice - Modifying Components
    2. 2.2 Basics of PSpice - Adding Libraries and Components
    3. 2.3 Basics of PSpice - Running Simulations
  4. 3Simulating the Junction Temperature in PSpice
  5. 4How to Leverage Thermal Simulations
  6. 5Model Limitations
  7. 6Conclusion

6 Conclusion

It is important to know how your device will act thermally so that efforts can be made to select the right device for your application. High-side switch devices offer many load protection features, among them, thermal shutdown. Although, thermal shutdown can affect whether or not a load can be driven using a high side switch device, this protection feature can be better understood and accounted for using the available PSpice models located on TI.com.