SLVAEZ0 November   2020 TPS1H000-Q1 , TPS1H100-Q1 , TPS1H200A-Q1 , TPS1HA08-Q1 , TPS1HB35-Q1 , TPS2H000-Q1 , TPS2H160-Q1 , TPS2HB16-Q1 , TPS2HB50-Q1 , TPS4H000-Q1 , TPS4H160-Q1

 

  1.   Trademarks
  2. 1Background
    1. 1.1 High-Side Switch
    2. 1.2 Thermal Modeling Using Electrical Analysis
    3. 1.3 Varying RDSON
  3. 2Using TI's SPICE Models With Incorporated Thermal Behavior
    1. 2.1 Basics of PSpice - Modifying Components
    2. 2.2 Basics of PSpice - Adding Libraries and Components
    3. 2.3 Basics of PSpice - Running Simulations
  4. 3Simulating the Junction Temperature in PSpice
  5. 4How to Leverage Thermal Simulations
  6. 5Model Limitations
  7. 6Conclusion

5 Model Limitations

The RC values representing the thermals of the package are based off calculations assuming JEDEC board, which refers to nominal silicon with a JEDEC standard board. For better adherence to the thermals of your package, new RC networks must be made to reflect your package thermals. For information on PCB layout and when to expect thermal shutdown for each device, reference the Layout Guidelines section of the data sheet for the desired high-side switch. These models are intended as a reference and should be interpreted with these limitations in mind.