SLVAFH0 December   2023 CSD13201W10 , CSD13302W , CSD13303W1015 , CSD13306W , CSD13380F3 , CSD13381F4 , CSD13383F4 , CSD13385F5 , CSD15380F3 , CSD17381F4 , CSD17382F4 , CSD17483F4 , CSD17484F4 , CSD17585F5 , CSD18541F5 , CSD22202W15 , CSD22204W , CSD22205L , CSD22206W , CSD23202W10 , CSD23203W , CSD23280F3 , CSD23285F5 , CSD23381F4 , CSD23382F4 , CSD25202W15 , CSD25211W1015 , CSD25213W10 , CSD25304W1015 , CSD25480F3 , CSD25481F4 , CSD25483F4 , CSD25484F4 , CSD25485F5 , CSD25501F3 , CSD75207W15 , CSD75208W1015 , CSD83325L , CSD85302L , CSD86311W1723 , CSD87501L

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Solving Assembly Issues with Chip Scale Power MOSFETs
  5. 2Land Grid Array (LGA) MOSFET Packaging Technology
  6. 3Wafer Level Chip Scale Packaging Technology
  7. 4Common Issues
  8. 5Best Practices
  9. 6Considerations When There are Problems
    1. 6.1 Tilted or Misaligned Packages
    2. 6.2 Solder Balls, Poor, or no Solder
    3. 6.3 Chipped or Cracked Devices
  10. 7Summary
  11. 8References

1 Solving Assembly Issues with Chip Scale Power MOSFETs

Texas Instruments manufactures high performance power MOSFETs in chip scale silicon, land grid array (LGA) packages with metalized pads and wafer level chip scale packages (WLCSP) with die-sized ball grid array (DSBGA) interconnect allowing attachment to a printed circuit board (PCB) using standard surface mount technology (SMT) assembly processes. Occasionally, manufacturers have reported problems processing these devices and achieving acceptable results. The article discusses some of the common issues and their recommended solutions. Figure 1-1, Figure 1-2, and Figure 1-3 shows TI LGA and WLCSP MOSFETs.

GUID-20221005-SS0I-GCVC-2JHM-7R4T8TCHFZWK-low.jpgFigure 1-1 TI LGA MOSFETs
GUID-20221005-SS0I-KM5P-766H-DZCC5MT90XQK-low.jpgFigure 1-3 TI WLCSP MOSFETs
GUID-20221005-SS0I-1KGR-B66V-QWHPPWJ4TMSL-low.jpgFigure 1-2 TI LGA MOSFETs