SLVAFH0 December   2023 CSD13201W10 , CSD13302W , CSD13303W1015 , CSD13306W , CSD13380F3 , CSD13381F4 , CSD13383F4 , CSD13385F5 , CSD15380F3 , CSD17381F4 , CSD17382F4 , CSD17483F4 , CSD17484F4 , CSD17585F5 , CSD18541F5 , CSD22202W15 , CSD22204W , CSD22205L , CSD22206W , CSD23202W10 , CSD23203W , CSD23280F3 , CSD23285F5 , CSD23381F4 , CSD23382F4 , CSD25202W15 , CSD25211W1015 , CSD25213W10 , CSD25304W1015 , CSD25480F3 , CSD25481F4 , CSD25483F4 , CSD25484F4 , CSD25485F5 , CSD25501F3 , CSD75207W15 , CSD75208W1015 , CSD83325L , CSD85302L , CSD86311W1723 , CSD87501L

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Solving Assembly Issues with Chip Scale Power MOSFETs
  5. 2Land Grid Array (LGA) MOSFET Packaging Technology
  6. 3Wafer Level Chip Scale Packaging Technology
  7. 4Common Issues
  8. 5Best Practices
  9. 6Considerations When There are Problems
    1. 6.1 Tilted or Misaligned Packages
    2. 6.2 Solder Balls, Poor, or no Solder
    3. 6.3 Chipped or Cracked Devices
  10. 7Summary
  11. 8References

2 Land Grid Array (LGA) MOSFET Packaging Technology

In 2013, TI introduced P and N-channel MOSFETs in the F4 FemtoFET™ LGA package. Since then, two more packages, F3 and F5, and numerous devices have filled out the FemtoFET™ product portfolio. Additionally, LGA technology has been extended to include single and dual FETs for multiple applications where small size and high performance are advantageous. Figure 2-1 and Figure 2-2 shows illustrations of the F4 and F5 FemtoFET™ devices.

GUID-20221005-SS0I-LMGF-FVGT-9XTWBPZKKD4X-low.svgFigure 2-1 F4 FemtoFET™ Package
GUID-20221005-SS0I-XQRD-DHM0-PX5VFKFPX9GL-low.gifFigure 2-2 F5 FemtoFET™ Package