SLVAFH0 December   2023 CSD13201W10 , CSD13302W , CSD13303W1015 , CSD13306W , CSD13380F3 , CSD13381F4 , CSD13383F4 , CSD13385F5 , CSD15380F3 , CSD17381F4 , CSD17382F4 , CSD17483F4 , CSD17484F4 , CSD17585F5 , CSD18541F5 , CSD22202W15 , CSD22204W , CSD22205L , CSD22206W , CSD23202W10 , CSD23203W , CSD23280F3 , CSD23285F5 , CSD23381F4 , CSD23382F4 , CSD25202W15 , CSD25211W1015 , CSD25213W10 , CSD25304W1015 , CSD25480F3 , CSD25481F4 , CSD25483F4 , CSD25484F4 , CSD25485F5 , CSD25501F3 , CSD75207W15 , CSD75208W1015 , CSD83325L , CSD85302L , CSD86311W1723 , CSD87501L

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Solving Assembly Issues with Chip Scale Power MOSFETs
  5. 2Land Grid Array (LGA) MOSFET Packaging Technology
  6. 3Wafer Level Chip Scale Packaging Technology
  7. 4Common Issues
  8. 5Best Practices
  9. 6Considerations When There are Problems
    1. 6.1 Tilted or Misaligned Packages
    2. 6.2 Solder Balls, Poor, or no Solder
    3. 6.3 Chipped or Cracked Devices
  10. 7Summary
  11. 8References

6.3 Chipped or Cracked Devices

Chipped or cracked packages are usually caused by handling before, during or after PCB assembly. This can lead to increased leakage current and long-term reliability issues. Chip scale MOSFETs are silicon die with solderable pads or balls and must be handled carefully during assembly to avoid cracking or chipping. Here are some useful tips

  1. Most handling is performed by machine processes during PCB assembly. Minimize manual handling.
  2. When manual handling is required, never use metal tweezers to pick up a device. Refer to the WCSP Handling Guide for handling guidance of these devices.
  3. Check the pick and place nozzle size. TI recommends using a nozzle with no larger than 75% of the shorter side of the package.
  4. Choose nozzle with soft tip instead of metal.
  5. Placement force should not exceed 3N.
  6. Do not poke or probe the body of the device with a metallic oscilloscope or digital multimeter probe.