SLVAEU0 September   2020 LM117HVQML-SP , LM117QML-SP , LM136A-2.5QML-SP , LM137JAN-SP , LM137QML-SP , LM185-1.2QML-SP , LM185-2.5QML-SP , LM2940QML-SP , LM2941QML-SP , LM4050QML-SP , LM723JAN-SP , LP2953QML-SP , TL1431-SP , TPS50601-SP , TPS50601A-SP , TPS7A4501-SP , TPS7H1101-SP , TPS7H1101A-SP , TPS7H1111-SP , TPS7H1121-SP , TPS7H2201-SP , TPS7H2211-SP , TPS7H3301-SP , TPS7H4001-SP , TPS7H4002-SP , TPS7H4011-SP , TPS7H5001-SP , TPS7H5002-SP , TPS7H5003-SP , TPS7H5004-SP , TPS7H6003-SP , TPS7H6013-SP , TPS7H6023-SP , UC1525B-SP , UC1611-SP , UC1705-SP , UC1707-SP , UC1708-SP , UC1709-SP , UC1710-SP , UC1715-SP , UC1823A-SP , UC1825-SP , UC1825A-SP , UC1825B-SP , UC1832-SP , UC1834-SP , UC1842-SP , UC1842A-SP , UC1843-SP , UC1843A-SP , UC1843B-SP , UC1844-SP , UC1844A-SP , UC1845-SP , UC1845A-SP , UC1846-SP , UC1856-SP , UC1863-SP , UC1875-SP , UC1901-SP , UC19432-SP , UCC1806-SP

 

  1.   Trademarks
  2. 1Reflow Profiles
  3. 2Critical Considerations for Gold-Plated Termination-Finishes
  4. 3Considerations for Leadless Ceramic Chip Carrier Packages
  5. 4Lead Forming
  6. 5Ceramic Packaging
  7. 6References

4 Lead Forming

Hermetic surface mount packages are typically sold non-formed as most customers have a preferred final form factor which can vary from customer to customer. Some use the default form factor available from third party service providers such as Fancort or Corfin. For reference, Fancort maintains a library of form factors on their website at Standard SMT Footprints. Fancort can also provide a lead-forming service or sell the fixtures for a customer to form in house. General information is found at Lead Forming Services. TI does not endorse or recommend these companies but only mentions them as example service providers.

For more information, contact TI Support at www.ti.com/support.