SN74ABT823

AKTIV

Flipflops, Bus-Schnittstelle mit 9 Bit, mit Tri-State-Ausgängen

Produktdetails

Number of channels 9 Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 150 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (µA) 38000 Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 9 Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 150 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (µA) 38000 Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
SOIC (DW) 24 159.65 mm² 15.5 x 10.3 SSOP (DB) 24 63.96 mm² 8.2 x 7.8
  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • High-Impedance State During Power Up and Power Down
  • High-Drive Outputs (-32-mA IOH, 64-mA IOL)
  • Buffered Control Inputs to Reduce dc Loading Effects
  • Package Options Include Plastic Small-Outline (DW) and Shrink Small-Outline (DB) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic (NT) and Ceramic (JT) DIPs

EPIC-IIB is a trademark of Texas Instruments Incorporated.

  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • High-Impedance State During Power Up and Power Down
  • High-Drive Outputs (-32-mA IOH, 64-mA IOL)
  • Buffered Control Inputs to Reduce dc Loading Effects
  • Package Options Include Plastic Small-Outline (DW) and Shrink Small-Outline (DB) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic (NT) and Ceramic (JT) DIPs

EPIC-IIB is a trademark of Texas Instruments Incorporated.

These 9-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing wider buffer registers, I/O ports, bidirectional bus drivers with parity, and working registers.

With the clock-enable (CLKEN\) input low, the nine D-type edge-triggered flip-flops enter data on the low-to-high transitions of the clock. Taking CLKEN\ high disables the clock buffer, thus latching the outputs. Taking the clear (CLR\) input low causes the nine Q outputs to go low, independently of the clock.

A buffered output-enable (OE\) input can be used to place the nine outputs in either a normal logic state (high or low logic level) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components.

When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT823 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT823 is characterized for operation from -40°C to 85°C.

These 9-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing wider buffer registers, I/O ports, bidirectional bus drivers with parity, and working registers.

With the clock-enable (CLKEN\) input low, the nine D-type edge-triggered flip-flops enter data on the low-to-high transitions of the clock. Taking CLKEN\ high disables the clock buffer, thus latching the outputs. Taking the clear (CLR\) input low causes the nine Q outputs to go low, independently of the clock.

A buffered output-enable (OE\) input can be used to place the nine outputs in either a normal logic state (high or low logic level) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components.

When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT823 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT823 is characterized for operation from -40°C to 85°C.

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Typ Titel Datum
* Data sheet 9-Bit Bus-Interface Flip-Flops With 3-State Outputs datasheet (Rev. E) 01 Mai 1997
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 15 Dez 2022
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) 16 Feb 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 Mai 2002
Selection guide Advanced Bus Interface Logic Selection Guide 09 Jan 2001
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 01 Jun 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 01 Mär 1997
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 01 Dez 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Okt 1996
Application note Live Insertion 01 Okt 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 Mai 1996

Design und Entwicklung

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Evaluierungsplatine

14-24-LOGIC-EVM — Generisches Logikprodukt-Evaluierungsmodul für 14-polige bis 24-polige D-, DB-, DGV-, DW-, DYY-, NS-

Das 14-24-LOGIC-EVM-Evaluierungsmodul (EVM) ist für die Unterstützung aller Logikgeräte konzipiert, die sich in einem 14-Pin- bis 24-Pin-D-, DW-, DB-, NS-, PW-, DYY- oder DGV-Gehäuse befinden.

Benutzerhandbuch: PDF | HTML
Simulationsmodell

SN74ABT823 IBIS Model

SCBM093.ZIP (17 KB) - IBIS Model
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
SOIC (DW) 24 Ultra Librarian
SSOP (DB) 24 Ultra Librarian

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