Gehäuseinformationen
| Gehäuse | Pins DSBGA (YFF) | 4 |
| Betriebstemperaturbereich (°C) -40 to 125 |
| Gehäusemenge | Träger 3.000 | LARGE T&R |
Merkmale von TMP103
- Multiple Device Access (MDA):
- Global Read/Write Operations
- I2C™ and SMBus™-Compatible Interface
- Resolution: 8 Bits
- Accuracy: ±1°C Typical (–10°C to 100°C)
- Low Quiescent Current:
- 3-µA Active IQ at 0.25 Hz
- 1-µA Shutdown
- Supply Range: 1.4 V to 3.6 V
- Digital Output
- 4-Ball WCSP (DSBGA) Package
Beschreibung von TMP103
The TMP103 is a digital output temperature sensor in a four-ball wafer chip-scale package (WCSP). The TMP103 is capable of reading temperatures to a resolution of 1°C.
The TMP103 features a two-wire interface that is compatible with both I2C and SMBus interfaces. In addition, the interface supports multiple device access (MDA) commands that allow the master to communicate with multiple devices on the bus simultaneously, eliminating the need to send individual commands to each TMP103 on the bus.
Up to eight TMP103s can be tied together in parallel and easily read by the host. The TMP103 is especially suitable for space-constrained, power-sensitive applications with multiple temperature measurement zones that must be monitored.
The TMP103 is specified for operation over a temperature range of –40°C to 125°C.