Circuitos de alto rendimiento Impact PAL

Detalles del producto

Rating Military Operating temperature range (°C) -55 to 125
Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 20 167.464 mm² 24.2 x 6.92
  • High-Performance Operation: Propagation Delay . . . 15 ns Max
  • Power-Up Clear on Registered Devices (All Register Outputs are Set High,
    but Voltage Levels at the Output Pins Go Low)
  • Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs
  • Dependable Texas Instruments Quality and Reliability

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.

  • High-Performance Operation: Propagation Delay . . . 15 ns Max
  • Power-Up Clear on Registered Devices (All Register Outputs are Set High,
    but Voltage Levels at the Output Pins Go Low)
  • Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs
  • Dependable Texas Instruments Quality and Reliability

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT-X™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.

IMPORTANT PROGAMMING NOTE: For TIBPAL16L8-15M devices in J, W, or FK packages - For date code 9903A or later device programming, select from either TI Military/16L8-12 or TI commercial TI/16L8-10 on the Manufacturer/Device menu listing in your programming system.

IMPORTANT PROGAMMING NOTE: For TIBPAL16R4-15M devices in J, W, or FK packages - For date code 9616A or later device programming, select from either TI Military/16R4-12 or TI commercial TI /16R4-10 on the Manufacturer/Device menu listing in your programming system.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT-X™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.

IMPORTANT PROGAMMING NOTE: For TIBPAL16L8-15M devices in J, W, or FK packages - For date code 9903A or later device programming, select from either TI Military/16L8-12 or TI commercial TI/16L8-10 on the Manufacturer/Device menu listing in your programming system.

IMPORTANT PROGAMMING NOTE: For TIBPAL16R4-15M devices in J, W, or FK packages - For date code 9616A or later device programming, select from either TI Military/16R4-12 or TI commercial TI /16R4-10 on the Manufacturer/Device menu listing in your programming system.

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Tipo Título Fecha
* Data sheet High-Performance Impact Programmable Array Logic Circuits.. datasheet (Rev. B) 02 nov 2011

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje