CSD97376Q4M
- 90% System Efficiency at 15 A
- Max Rated Continuous Current 20 A, Peak 45 A
- High-Frequency Operation (up to 2 MHz)
- High-Density SON 3.5-mm x 4.5-mm Footprint
- Ultra-Low Inductance Package
- System Optimized PCB Footprint
- Ultra-Low Quiescent (ULQ) Current Mode
- 3.3-V and 5-V PWM Signal Compatible
- Diode Emulation Mode with FCCM
- Input Voltages up to 24 V
- Tri-State PWM Input
- Integrated Bootstrap Diode
- Shoot-Through Protection
- RoHS Compliant – Lead-Free Terminal Plating
- Halogen Free
The CSD97376Q4M NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows™ 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high-current, high-efficiency, and high-speed switching device in a small 3.5-mm × 4.5-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.
技術資料
| 種類 | タイトル | 最新の英語版をダウンロード | 日付 | |||
|---|---|---|---|---|---|---|
| * | データシート | CSD97376Q4M Synchronous Buck NexFET™ Power Stage データシート (Rev. B) | PDF | HTML | 2016年 8月 15日 |
設計および開発
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| パッケージ | ピン数 | CAD シンボル、フットプリント、および 3D モデル |
|---|---|---|
| VSON-CLIP (DPC) | 8 | Ultra Librarian |
購入と品質
- RoHS
- REACH
- デバイスのマーキング
- リード端子の仕上げ / ボールの原材料
- MSL 定格 / ピーク リフロー
- MTBF/FIT 推定値
- 使用原材料
- 認定試験結果
- 継続的な信頼性モニタ試験結果
- ファブの拠点
- 組み立てを実施した拠点