TPS2056A
- 80-m High-Side MOSFET Switch
- 250 mA Continuous Current Per Channel
- Independent Thermal and Short-Circuit Protection With Overcurrent Logic Output
- Operating Range: 2.7-V to 5.5-V
- CMOS- and TTL-Compatible Enable Inputs
- 2.5-ms Typical Rise Time
- Undervoltage Lockout
- 10 µA Maximum Standby Supply Current for Single and Dual (20 µA for Triple and Quad)
- Bidirectional Switch
- Ambient Temperature Range, 0°C to 85°C
- ESD Protection
The TPS2045A through TPS2048A and TPS2055A through TPS2058A power-distribution switches are intended for applications where heavy capacitive loads and short circuits are likely to be encountered.
These devices incorporate 80-m N-channel MOSFET high-side power switches for power-distribution systems that require multiple power switches in a single package. Each switch is controlled by an independent logic enable input. Gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. The charge pump requires no external components and allows operation from supplies as low as 2.7 V.
When the output load exceeds the current-limit threshold or a short is present, these devices limit the output current to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When continuous heavy overloads and short circuits increase the power dissipation in the switch, causing the junction temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures the switch remains off until valid input voltage is present. These power-distribution switches are designed to current limit at 0.5 A.
技術資料
種類 | タイトル | 最新の英語版をダウンロード | 日付 | |||
---|---|---|---|---|---|---|
* | データシート | Current Limited Power-Distribution Switches データシート (Rev. C) | 2008年 1月 15日 | |||
EVM ユーザー ガイド (英語) | Two-Channel, Power-Distribution Switch EVM (Rev. A) | 2012年 6月 1日 |
設計および開発
その他のアイテムや必要なリソースを参照するには、以下のタイトルをクリックして詳細ページをご覧ください。
パッケージ | ピン数 | CAD シンボル、フットプリント、および 3D モデル |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
購入と品質
- RoHS
- REACH
- デバイスのマーキング
- リード端子の仕上げ / ボールの原材料
- MSL 定格 / ピーク リフロー
- MTBF/FIT 推定値
- 使用原材料
- 認定試験結果
- 継続的な信頼性モニタ試験結果
- ファブの拠点
- 組み立てを実施した拠点