TPS659119-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified with the Following Results:
- Device Temperature Grade 3: –40°C to 85°C Ambient Operating Temperature Range
- Device HBM ESD Classification Level 2
- Device CDM ESD Classification Level C4B
- Embedded Power Controller (EPC) With EEPROM Programmability
- Two Efficient Step-Down DC-DC Converters With Dynamic Voltage Scaling for Processor Cores (VDD1, VDD2)
- One Efficient Step-Down DC-DC Converter for I/O Power (VIO)
- An Interface to Control an External DCDC Converter (EXTCTRL)
- Eight LDO Voltage Regulators and One RTC LDO (Supply for Internal RTC)
- One High-Speed I2C Interface for General-Purpose Control Commands (CTL-I2C)
- Two Independent Enable Signals for Controlling Power Resources (EN1, EN2) Which can be Used as a High-Speed I2C Interface Dedicated for VDD1 and VDD2 Voltage Scaling.
- Thermal Shutdown Protection and Hot-Die Detection
- A Real-Time Clock (RTC) Resource with:
- Fast Start-Up 16.384-MHz Crystal Oscillator
- Configurable Clock Source from Crystal Oscillator, External 32-kHz Clock or Internal 32-kHz RC Oscillator
- Date, Time, and Calendar
- Alarm Capability
- Nine Configurable GPIOs with Multiplexed Feature Support:
- Four can be Used as Enable for External Resources, Included into Power-Up Sequence and Controlled by State-Machine
- As GPI, GPIOs Support Logic-level Detection and Can Generate Maskable Interrupt for Wake-Up
- Two of the GPIOs Have 10-mA Current Sink Capability for Driving LEDs
- DCDCs Switching Synchronization Through an External 3-MHz Clock
- Two Reset Inputs for Cold Reset (HDRST) and a Power-Initialization Reset (PWRDN) for Thermal Reset Input
- 32-kHz Clock Output (CLK32KOUT) and System Reset (NRESPWRON) Included in Power Sequence
- Watchdog
- Two ON and OFF LED-Pulse Generators and One PWM Generator
All trademarks are the property of their respective owners.
The TPS659119-Q1 device is an integrated power-management IC dedicated to systems using an applications processor requiring multiple power rails. The device provides three step-down converters, one control for an external converter, eight LDOs, and is designed to be flexible for supporting different processors and applications.
Two of the step-down converters provide power for dual-processor cores and support for dynamic voltage scaling by a dedicated I2C interface for optimum power savings. The third converter provides power for inputs and outputs (I/Os) and memory in the system. The control for an external converter can sequence and scale the voltage of an external converter for a high-current rail in the system.
For all available packages, see the orderable addendum at the end of the data sheet.All trademarks are the property of their respective owners.
The device also includes eight general-purpose LDOs providing a wide range of voltage and current capabilities. Five of the LDOs support 1 to 3.3 V with 100-mV steps, and three LDOs support 1 to 3.3 V with 50-mV steps. All LDOs are fully controllable by the I2C interface.
In addition to the power regulators, the device contains nine configurable GPIOs with multiplexing features to support a wide variety of functions. The device also includes an embedded power controller to manage the power sequencing requirements of the system. The power sequencing is programmable by EEPROM.
技術資料
種類 | タイトル | 最新の英語版をダウンロード | 日付 | |||
---|---|---|---|---|---|---|
* | データシート | TPS659119-Q1 Automotive Integrated Power-Management Unit データシート (Rev. F) | PDF | HTML | 2016年 7月 7日 | ||
セレクション・ガイド | 電源 IC セレクション・ガイド 2018 (Rev. R 翻訳版) | 英語版 (Rev.R) | 2018年 9月 13日 | |||
ホワイト・ペーパー | Power Management IC (PMIC) Guide for Automotive (Rev. A) | 2014年 10月 29日 | ||||
アプリケーション・ノート | Reference Design | 2013年 2月 4日 | ||||
アプリケーション・ノート | Schematic Checklist | 2013年 1月 31日 |
設計および開発
その他のアイテムや必要なリソースを参照するには、以下のタイトルをクリックして詳細ページをご覧ください。
パッケージ | ピン数 | CAD シンボル、フットプリント、および 3D モデル |
---|---|---|
HTQFP (PFP) | 80 | Ultra Librarian |
購入と品質
- RoHS
- REACH
- デバイスのマーキング
- リード端子の仕上げ / ボールの原材料
- MSL 定格 / ピーク リフロー
- MTBF/FIT 推定値
- 使用原材料
- 認定試験結果
- 継続的な信頼性モニタ試験結果
- ファブの拠点
- 組み立てを実施した拠点