계산 툴
BQ51003
- Integrated Wireless Power Supply Receiver Solution - Optimized for 2.5-W Applications
- 93% Overall Peak AC-DC Efficiency
- Full Synchronous Rectifier
- WPC v1.2 Compliant Communication Control
- Output Voltage Conditioning
- Only IC Required Between Rx coil and Output
- Wireless Power Consortium (WPC) v1.2 Compliant (FOD Enabled) Highly Accurate Current Sense
- Dynamic Rectifier Control for Improved Load Transient Response
- Dynamic Efficiency Scaling for Optimized Performance Over Wide Range of Output Power
- Adaptive Communication Limit for Robust Communication
- Supports 20-V Maximum Input
- Low-power Dissipative Rectifier Overvoltage Clamp (VRECT-OVP = 15 V)
- Thermal Shutdown
- Multifunction NTC and Control Pin for Temperature Monitoring, Charge Complete and Fault Host Control
The bq51003 is an advanced, integrated, receiver IC for wireless power transfer in portable applications optimized for 2.5-W and below applications. The device provides the AC-DC power conversion while integrating the digital control required to comply with the Qi v1.2 communication protocol. Together with the bq500212A transmitter controller, the bq51003 enables a complete contact-less power transfer system for a wireless power supply solution. By using near-field inductive power transfer, the receiver coil embedded in the portable device receives the power transmitted by the transmitter coil through mutually coupled inductors. The AC signal from the receiver coil is then rectified and regulated to be used as a power supply for down-system electronics. Global feedback is established from the secondary to the transmitter to stabilize the power transfer process through back-scatter modulation. This feedback is established by using the Qi v1.2 communication protocol supporting up to 2.5-W applications.
The device integrates a low-impedance full synchronous rectifier, low-dropout regulator, digital control, and accurate voltage and current loops.
기술 자료
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4개 모두 보기 | 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | bq51003 Highly Integrated Wireless Receiver Qi (WPC v1.2) Compliant Power Supply datasheet (Rev. C) | PDF | HTML | 2018/07/30 |
| Test report | Power Management Reference Design for a Wearable Device with Wireless Charging (Rev. A) | PDF | HTML | 2016/04/14 | |
| More literature | Adapting Qi-compliant wireless-power solutions to low-power wearable products | 2014/06/06 | ||
| User guide | bq51003EVM-764 Evaluation Module (WCSP Package) | 2013/11/23 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
레퍼런스 디자인
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Wearable devices require advanced power management to achieve long battery run times with always-on functionality. Additionally, the devices need to use small rechargeable batteries and enable small footprint designs. This application note shows the implementation of a scalable power (...)
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The TIDA-00881 reference design is a booster pack that provides a wireless charger and an entire battery managment solution to power any low power TI Launchpad. This design is a highly integrated power management solution that is well-suited for ultra-low power applications using an off the (...)
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This reference design is for smartwatch battery management solution (BMS). It is suitable for low-power wearable devices like smartwatch applications. The design includes an ultra-low current 1 cell Li-ion linear charger; a highly integrated Qi-compliant wireless power receiver; a (...)
레퍼런스 디자인
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The TIDA-00668 is a booster pack that provides a wireless charger and an entire battery managment solution to power any low power TI Launchpad. This design is a highly integrated power management solution that is well-suited for ultra-low power applications.
The primary method of storage is an (...)
레퍼런스 디자인
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This reference design is suitable for low power wearable devices including a Qi-compliant wireless receiver (bq51003) and ultra-low current 1-cell Li-ion linear charger (bq25100). It features an ultra-small size (5 x 15 mm2), capable of low-charging currents down to 10 mA and up to 250 mA with (...)
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| DSBGA (YFP) | 28 | Ultra Librarian |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.