제품 상세 정보

Vin (max) (V) 10 Absolute max Vin (max) (V) 20 Vin (min) (V) 4 Rating Catalog Operating temperature range (°C) 0 to 125
Vin (max) (V) 10 Absolute max Vin (max) (V) 20 Vin (min) (V) 4 Rating Catalog Operating temperature range (°C) 0 to 125
DSBGA (YFP) 28 5.4 mm² 1.8 x 3 VQFN (RHL) 20 15.75 mm² 4.5 x 3.5
  • Integrated Wireless Power Supply Receiver Solution
    • 93% Overall peak AC-DC efficiency
    • Full synchronous rectifier
    • WPC v1.2 compliant communication control
    • Output voltage conditioning
    • Only IC required between Rx coil and output
  • Wireless power consortium (WPC) v1.2 compliant (FOD enabled) highly accurate current sense
  • Dynamic rectifier control for improved load transient response
  • Dynamic efficiency scaling for optimized performance over wide range of output power
  • Adaptive communication limit for robust communication
  • Supports 20-V maximum input
  • Low-power dissipative rectifier overvoltage clamp (VOVP = 15 V)
  • Thermal shutdown
  • Multifunction NTC and control pin for temperature monitoring, charge complete, and fault host control
  • Integrated Wireless Power Supply Receiver Solution
    • 93% Overall peak AC-DC efficiency
    • Full synchronous rectifier
    • WPC v1.2 compliant communication control
    • Output voltage conditioning
    • Only IC required between Rx coil and output
  • Wireless power consortium (WPC) v1.2 compliant (FOD enabled) highly accurate current sense
  • Dynamic rectifier control for improved load transient response
  • Dynamic efficiency scaling for optimized performance over wide range of output power
  • Adaptive communication limit for robust communication
  • Supports 20-V maximum input
  • Low-power dissipative rectifier overvoltage clamp (VOVP = 15 V)
  • Thermal shutdown
  • Multifunction NTC and control pin for temperature monitoring, charge complete, and fault host control

The BQ51013B device is a single-chip, advanced, flexible, secondary-side device for wireless power transfer in portable applications capable of providing up to 5 W. The BQ51013B devices provide the receiver (RX) AC-to-DC power conversion and regulation while integrating the digital control required to comply with the Wireless Power Consortium (WPC) Qi v1.2 communication protocol. Together with the BQ50012A primary-side controller (or other Qi transmitter), the BQ51013B enables a complete contactless power transfer system for a wireless power supply solution. Global feedback is established from the secondary to the primary to control the power transfer process using the Qi v1.2 protocol.

The BQ51013B integrates a low-resistance synchronous rectifier, low-dropout regulator (LDO), digital control, and accurate voltage and current loops to ensure high efficiency and low power dissipation.

The BQ51013B also includes a digital controller that calculates the amount of power received by the mobile device within the limits set by the WPC v1.2 standard. The controller then communicates this information to the transmitter (TX) to allow the TX to determine if a foreign object is present within the magnetic interface and introduces a higher level of safety within magnetic field. This Foreign Object Detection (FOD) method is part of the requirements under the WPC v1.2 specification.

The BQ51013B device is a single-chip, advanced, flexible, secondary-side device for wireless power transfer in portable applications capable of providing up to 5 W. The BQ51013B devices provide the receiver (RX) AC-to-DC power conversion and regulation while integrating the digital control required to comply with the Wireless Power Consortium (WPC) Qi v1.2 communication protocol. Together with the BQ50012A primary-side controller (or other Qi transmitter), the BQ51013B enables a complete contactless power transfer system for a wireless power supply solution. Global feedback is established from the secondary to the primary to control the power transfer process using the Qi v1.2 protocol.

The BQ51013B integrates a low-resistance synchronous rectifier, low-dropout regulator (LDO), digital control, and accurate voltage and current loops to ensure high efficiency and low power dissipation.

The BQ51013B also includes a digital controller that calculates the amount of power received by the mobile device within the limits set by the WPC v1.2 standard. The controller then communicates this information to the transmitter (TX) to allow the TX to determine if a foreign object is present within the magnetic interface and introduces a higher level of safety within magnetic field. This Foreign Object Detection (FOD) method is part of the requirements under the WPC v1.2 specification.

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기술 자료

star =TI에서 선정한 이 제품의 인기 문서
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5개 모두 보기
유형 직함 날짜
* Data sheet BQ51013B Highly Integrated Wireless Receiver Qi (WPC v1.2) Compliant Power Suppl datasheet (Rev. D) 2020/09/22
White paper Understanding Functional Safety FIT Base Failure Rate Estimates per IEC 62380 and SN 29500 (Rev. A) PDF | HTML 2024/04/30
Product overview Battery Management Solutions for Wearable and Fitness Devices (Rev. C) 2014/08/18
Application note Test and Troubleshoot a Wireless Power Receiver 2014/08/06
EVM User's guide bq51013xEVM-764 Evaluation Module (WCSP Package) (Rev. A) 2013/08/05

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

계산 툴

SLUC577 Foreign Object Detection (FOD) Calibration/Tuning Tool

lock = 수출 승인 필요(1분)
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
배터리 충전기 IC
BQ51003 BQ51003 무선 전원 리시버 BQ51010B 고집적 무선 리시버 Qi(WPC V1.1) 호환 전원 공급 장치 BQ51013B WPC 1.1 호환, 완전 통합형 무선 전원 리시버 IC BQ51020 5W(WPC) 싱글 칩 무선 전원 리시버 BQ51021 I2C가 포함된 5W(WPC) 단일 칩 무선 전원 리시버 BQ51025 bq51025 10W WPC 호환 싱글 칩 무선 전원 리시버 BQ51050B Qi(WPC) 준수 고집적 2차측 다이렉트 리튬 이온 충전기 BQ51051B 통합형 무선 전원 리튬 이온 충전기 리시버, Qi(WPC) 준수 BQ51052B BQ51052B 통합형 무선 전원 리튬 이온 충전기 리시버, Qi(WPC) 호환 BQ51221 듀얼 모드 5W(WPC 및 PMA) 싱글 칩 무선 전원 리시버 BQ51222 듀얼 모드 5-W(WPC v1.2 및 PMA) 싱글 칩 무선 전원 리시버
거버(Gerber) 파일

bq51013B Gerber

SLUC632.ZIP (622 KB)
패키지 CAD 기호, 풋프린트 및 3D 모델
DSBGA (YFP) 28 Ultra Librarian
VQFN (RHL) 20 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

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