CDC319
- High-Speed, Low-Skew 1-to-10 Clock Buffer for SDRAM (Synchronous DRAM) Clock Buffering Applications
- Output Skew, tsk(o), Less Than 250 ps
- Pulse Skew, tsk(p), Less Than 500 ps
- Supports up to Two Unbuffered SDRAM DIMMs (Dual Inline Memory Modules)
- I2C Serial Interface Provides Individual Enable Control for Each Output
- Operates at 3.3 V
- Distributed VCC and Ground Pins Reduce Switching Noise
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015
- Packaged in 28-Pin Shrink Small Outline (DB) Package
The CDC319 is a high-performance clock buffer that distributes one input (A) to 10 outputs (Y) with minimum skew for clock distribution. The CDC319 operates from a 3.3-V power supply, and is characterized for operation from 0°C to 70°C.
The device provides a standard mode (100K-bits/s) I2C serial interface for device control. The implementation is as a slave/receiver. The device address is specified in the I2C device address table. Both of the I2C inputs (SDATA and SCLOCK) provide integrated pullup resistors (typically 140 k) and are 5-V tolerant.
Three 8-bit I2C registers provide individual enable control for each of the outputs. All outputs default to enabled at powerup. Each output can be placed in a disabled mode with a low-level output when a low-level control bit is written to the control register. The registers are write only and must be accessed in sequential order (i.e., random access of the registers is not supported).
The CDC319 provides 3-state outputs for testing and debugging purposes. The outputs can be placed in a high-impedance state via the output-enable (OE) input. When OE is high, all outputs are in the operational state. When OE is low, the outputs are placed in a high-impedance state. OE provides an integrated pullup resistor.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | 1-Line To 10-Line Clock Driver datasheet (Rev. A) | 2001/10/25 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SSOP (DB) | 28 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치