ESD122
- IEC 61000-4-2 Level 4 ESD Protection
- ±17-kV Contact Discharge
- ±17-kV Air Gap Discharge
- Withstands over 10,000 ESD strikes per IEC 61000-4-2 Level 4 (Contact) without any performance degradation
- IEC 61000-4-4 EFT Protection
- 80 A (5/50 ns)
- IEC 61000-4-5 Surge Protection
- 2.5 A (8/20 µs)
- Low IO Capacitance
- 0.1 pF (Typical) between IOs
- 0.2 pF (Typical) IO to GND
- DC Breakdown Voltage: 5.1 V (Minimum)
- Ultra Low Leakage Current: 10 nA (Maximum)
- Low ESD Clamping Voltage: 8.4 V at 5-A TLP
- Supports High Speed Interfaces that exceed 10 Gbps
- Industrial Temperature Range: –40°C to +125°C
- Type C Friendly Two Channel Flow-Through Routing Package
- Pin-out to suit symmetric differential high-speed signal routing
- Two Different Package Options
- 0402 Package, 0.6 mm × 1 mm, 0.34-mm Pitch
- 0502 Package, 0.6 mm × 1.32 mm, 0.5-mm Pitch
The ESD122 is a bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The ESD122 is rated to dissipate contact ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (17-kV Contact, 17-kV Air-gap).
This device features a low IO capacitance per channel and pin-out to suit symmetric differential high-speed signal routing making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2 and HDMI 2.0. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.
Additionally, the ESD122 is an ideal ESD solution for the USB Type-C Tx/Rx lines. Since the USB Type-C connector has two layers, using 4-channel ESD devices require VIAs which degrade the signal integrity. Using four ESD122 (2-Ch) devices minimize the number of VIAs and simply the board layout.
The ESD122 is offered in two easy routing flow through packages.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | ESD122 2-Channel ESD Protection Diode for USB Type-C and HDMI 2.0 datasheet (Rev. A) | PDF | HTML | 2018/08/13 |
Application note | ESD and Surge Protection for USB Interfaces (Rev. B) | PDF | HTML | 2024/01/11 | |
Application brief | ESD Protection for HDMI Applications (Rev. A) | PDF | HTML | 2023/11/01 | |
Application note | Capacitance Requirements for High Speed Signals (Rev. A) | PDF | HTML | 2023/08/21 | |
Selection guide | System-Level ESD Protection Guide (Rev. D) | 2022/09/07 | ||
Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022/08/18 | |
User guide | Generic ESD Evaluation Module User's Guide (Rev. A) | PDF | HTML | 2021/09/27 | |
Technical article | ESD fundamentals, part 4: ESD capacitance | PDF | HTML | 2018/02/12 | |
Technical article | ESD fundamentals, part 3: clamping voltage | PDF | HTML | 2017/12/06 | |
Application note | ESD224 HDMI 2.0 Compliance and Protection | 2017/11/30 | ||
Technical article | Big USB Type-C™ protection for your small application | PDF | HTML | 2017/07/31 |
설계 및 개발
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ESDEVM — ESD 평가 모듈
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
X2SON (DMX) | 3 | Ultra Librarian |
X2SON (DMY) | 3 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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