ESD224
- IEC 61000-4-2 Level 4 ESD Protection
- ±12-kV Contact Discharge
- ±15-kV Air Gap Discharge
- IEC 61000-4-4 EFT Protection
- 80 A (5/50 ns)
- IEC 61000-4-5 Surge Protection
- 2 A (8/20 µs)
- IO Capacitance:
- 0.5 pF (Typical)
- HDMI 2.0 Compliant
- Ultra-Low Leakage Current: 0.1 nA (Typical)
- Ultra-Low ESD Clamping Voltage: 8 V at 16-A TLP (System Side)
- Supports High Speed Interfaces up to 6 Gbps
- Industrial Temperature Range: –40°C to +125°C
- Industry Standard DQA Package
The ESD224 is a bidirectional TVS ESD protection diode array for high speed applications such as USB 3.0 and HDMI 2.0. The ESD224 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4). The ESD224 employs on-chip differentially matched series elements to enhance down-stream ESD clamping performance while maintaining the signal compliance for high speed interfaces. The ultra-low clamping performance and high differential bandwidth provided by the ESD224 on-chip ESD protection network enables the device to be HDMI 2.0 compliant while providing robust protection to downstream HDMI devices.
The ESD224 is offered in the industry standard USON-10 (DQA) package. The package features 0.5-mm pin pitch easing implementation and reducing design time.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | ESD224 Low Clamping 4-Channel ESD Protection Device for HDMI Interface datasheet (Rev. A) | PDF | HTML | 2018/03/29 |
Application note | ESD and Surge Protection for USB Interfaces (Rev. B) | PDF | HTML | 2024/01/11 | |
Application brief | ESD Protection for HDMI Applications (Rev. A) | PDF | HTML | 2023/11/01 | |
Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022/08/18 | |
Application note | ESD224 HDMI 2.0 Compliance and Protection | 2017/11/30 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
ESDEVM — ESD 평가 모듈
TIDA-050001 — HDMI 2.0 ESD 보호 레퍼런스 설계
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
USON (DQA) | 10 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.