ESD341
- IEC 61000-4-2 level 4 ESD protection
- 30 kV contact discharge
- 30 kV air gap discharge
- IEC 61000-4-5 surge protection
- 5.4 A (8/20 µs)
- IO capacitance:
- 0.66 pF (typical)
- DC breakdown voltage: ±6.2 V (typical)
- Ultra low leakage current: 100 nA (maximum)
- Low ESD clamping voltage: 10.2 V at 16 A TLP
- Low insertion loss: 5 GHz (–3 dB bandwidth, DPL)
- Supports high speed interfaces up to 3.4 Gbps
- Industrial temperature range: –40°C to +125°C
- Space-saving industry standard 0201 footprint (0.6 mm × 0.3 mm × 0.3 mm)
The ESD341 is a bidirectional TVS ESD protection diode for HDMI 1.4 circuit protection. The ESD341 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).
This device features a 0.66 pF (typical) IO capacitance enabling high-speed interface protection up to 3.4 Gbps including support for protocols such as HDMI 1.4b. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.
The 30 kV ESD rating and 5.4 A surge provides robust transient protection in a tiny package for protecting 3.6 V power rails in portable electronics and other space constrained applications such as wearables.
The ESD341 is offered in the industry standard 0201 (DPL) package.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | ESD341 1-Channel ± 30 kV ESD Protection Diode in 0201 Package datasheet (Rev. A) | PDF | HTML | 2022/07/19 |
| Application note | ESD and Surge Protection for USB Interfaces (Rev. B) | PDF | HTML | 2024/01/11 | |
| Application brief | ESD Protection for HDMI Applications (Rev. A) | PDF | HTML | 2023/11/01 | |
| Product overview | Isolated USB Repeater (Rev. B) | PDF | HTML | 2023/08/22 | |
| Selection guide | System-Level ESD Protection Guide (Rev. D) | 2022/09/07 | ||
| Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022/08/18 | |
| Analog Design Journal | Design Considerations for System-Level ESD Circuit Protection | 2012/09/25 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
ESDEVM — ESD 평가 모듈
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| X2SON (DPL) | 2 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.