SN74AC08-EP

마지막 구매

향상된 제품, 4채널, 2입력 2V~6V 고속(7ns) 24mA 드라이브 강도 AND 게이트

제품 상세 정보

Technology family AC Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type Standard CMOS Output type Push-Pull Features Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 100 Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
Technology family AC Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type Standard CMOS Output type Push-Pull Features Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 100 Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
SOIC (D) 14 51.9 mm² 8.65 x 6
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of −55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree†
  • 2-V to 6-V V CC Operation
  • Inputs Accept Voltages to 6 V
  • Max t pd of 7.5 ns at 5 V

(1)† Component qualification in accordance with JEDEC and industry standards to provide reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of −55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree†
  • 2-V to 6-V V CC Operation
  • Inputs Accept Voltages to 6 V
  • Max t pd of 7.5 ns at 5 V

(1)† Component qualification in accordance with JEDEC and industry standards to provide reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The SN74AC08 is a quadruple 2-input positive-AND gate. This device performs the Boolean function Y = A • B or Y = A + B in positive logic.

The SN74AC08 is a quadruple 2-input positive-AND gate. This device performs the Boolean function Y = A • B or Y = A + B in positive logic.

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기술 자료

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15개 모두 보기
유형 직함 날짜
* Data sheet SN74AC08-EP Quadruple 2-Input Positive-and Gate datasheet (Rev. A) PDF | HTML 2023/06/28
* VID SN74AC08-EP VID V6204615 2016/06/21
* Radiation & reliability report SN74AC08MDREP Reliability Report 2012/06/04
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
More literature HiRel Unitrode Power Management Brochure 2009/07/07
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Designing With Logic (Rev. C) 1997/06/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996/04/01

설계 및 개발

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패키지 CAD 기호, 풋프린트 및 3D 모델
SOIC (D) 14 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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