AMC3302
- 3.3-V or 5-V single supply with integrated DC/DC converter
- ±50-mV input voltage range optimized for current measurement using shunt resistors
- Fixed gain: 41
- Low DC errors:
- Offset voltage: ±50 µV (max)
- Offset drift: ±0.5 µV/°C (max)
- Gain error: ±0.2% (max)
- Gain error drift: ±35 ppm/°C (max)
- Nonlinearity: ±0.03% (max)
- High CMTI: 95 kV/µs (min)
- System-level diagnostic features
- Meets CISPR-11 and CISPR-25 EMI standards
- Safety-related certifications:
- 6000-VPK reinforced isolation per DIN VDE V 0884-11
- 4250-VRMS isolation for 1 minute per UL1577
- Fully specified over the extended industrial temperature range: –40°C to +125°C
The AMC3302 is a precision, isolated amplifier optimized for shunt-based current measurements. The fully integrated, isolated DC/DC converter allows single-supply operation from the low-side of the device, which makes the device a unique solution for space-constrained applications. The reinforced capacitive isolation barrier is certified according to VDE V 0884-11 and UL1577 and supports a working voltage of up to 1.2 kVRMS.
The isolation barrier separates parts of the system that operate on different common-mode voltage levels and protects the low-voltage side from hazardous voltages and damage.
The input of the AMC3302 is optimized for direct connection to a low-impedance shunt resistor or another low-impedance voltage source with low signal levels. The excellent DC accuracy and low temperature drift supports accurate current measurements over the extended industrial temperature range from –40°C to +125°C.
The integrated DC/DC converter fault-detection and diagnostic output pin of the AMC3302 simplify system-level design and diagnostics.
技術文件
設計與開發
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AMC3302EVM — 適用於 ±50-mV 輸入精密強化型隔離放大器的 AMC3302 評估模組
AMC3302 評估模組 (EVM) 是用於評估 AMC3302 的平台,此平台是具備整合式 DC/DC 轉換器的精密隔離式放大器,可供電給放大器高壓側。AMC3302 是一款 7-kV 強化型隔離式放大器,主要設計用於電流分流測量應用。
使用指南中包含完整的電路描述、電路圖和物料清單 (BOM)。
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SO-MOD (DWE) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。