CD4030B-MIL
- Medium-speed operation—tPHL, tPLH = 65 ns (typ.) at VDD = 10 V, CL = 50 pF
- 100% tested for quiescent current at 20 V
- Standardized, symmetrical output characteristics
- 5-V, 10-V, and 15-V parametric ratings
- Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
- Noise margin (over full package-temperature range) =
1 V at VDD = 5 V
2 V at VDD = 10 V
2.5 V at VDD = 15 V - Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"
- Applications:
- Even and odd-parity generators and checkers
- Logical comparators
- Adders/subtractors
- General logic functions
Data sheet acquired from Harris Semiconductor
CD4030B types consist of four independent Exclusive-OR gates. THe CD4030B provides the system designer with a means for direct implementation of the Exclusive-OR function.
The CD4030B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).
技術文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 7 類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | CD4030B TYPES datasheet (Rev. C) | 2003年 8月 21日 | |
Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
User guide | Signal Switch Data Book (Rev. A) | 2003年 11月 14日 | ||
Application note | Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics | 2001年 12月 3日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
CDIP (J) | 14 | Ultra Librarian |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點