CD4082B-MIL
- Medium-Speed Operation - tPLH, tPHL = 60 ns (typ.) at VDD = 10 V
- 100% tested for quiescent current at 20 V
- Maximum input current of 1 µA at 18 V over full package-temperature range: 100 nA at 18 V and 25°C
- Noise margin (full package-temperature range) =
- 1 V at VDD = 5 V
- 2 V at VDD = 10 V
- 2.5 V at VDD = 15 V
- Standardized, symmetrical output characteristics
- 5-V, 10-V, and 15-V parametric ratings
- Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"
CD4073B Triple 3-Input AND Gate
CD4081B Quad 2-Input AND Gate
CD4082B Dual 4-Input AND Gate
Data sheet acquired from Harris Semiconductor
CD4073B, CD4081B and CD4082B AND gates, provide the system designer with direct implementation of the AND function and supplement the existing family of CMOS gates.
The CD4073B, CD4081B, and CD4082B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).
技術文件
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檢視所有 8 類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | CD4073B, CD4081B, CD4082B TYPES datasheet (Rev. C) | 2003年 8月 21日 | |
* | SMD | CD4082B-MIL SMD 7705902CA | 2016年 6月 21日 | |
Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
User guide | Signal Switch Data Book (Rev. A) | 2003年 11月 14日 | ||
Application note | Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics | 2001年 12月 3日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
CDIP (J) | 14 | Ultra Librarian |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點