OPT9221
- QVGA 3D ToF Controller: Up to 120 FPS
- Depth Data:
- 12-Bit Phase
- Up to 12-Bit Amplitude
- Up to 4-Bit Ambient
- Saturation Detection
- Chipset Interface:
- Compatible with TI ToF Sensor (OPT8241)
- Output (CMOS, 8-Lane Data, 8 Control Signals,
and Clock):- Digital Video Protocol (DVP)-Compatible:
- Data, VD, HD, Clock
- Synchronous Serial Interface (SSI)-Compatible
- Digital Video Protocol (DVP)-Compatible:
- Depth Engine:
- Pixel Binning
- Region of Interest (ROI)
- De-Aliasing
- Non-linearity Correction
- Temperature Compensation
- High Dynamic Range Operation
- Spatial Filter
- Timing Coordinator:
- Sensor Control
- Master and Slave Sync Operation
- I2C Slave Interface
- Power Supply: 1.2-V Core, 1.8-V I/O, 3.3-V I/O
2.5-V Analog - Package: 256-Pin, 9-mm × 9-mm NFBGA
- Operating Temperature: 0°C to 85°C
The time-of-flight controller (TFC) is a high-performance, 3D time-of-flight (ToF) sensor companion device that computes the depth data from the digitized sensor data. Depth data are output via a programmable complementary metal-oxide-semiconductor (CMOS) parallel interface.
In addition to depth data, the TFC provides auxiliary information consisting of amplitude, ambient, and flags for each pixel. This information can be used to implement filters and masks and to dynamically control the system configuration for the intended performance.
The TFC supports a wide range of binning and ROI options that help optimize the data throughput that must be handled.
The 9-mm × 9-mm NFBGA package enables small form-factor, 3D, ToF systems that can be embedded into a variety of end equipment.
技術文件
設計與開發
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LIGHTSOURCE01EVM 是穩定且一致的光源，可用於校準周圍光源感測器 (ALS) 和色彩感測器。此光源專為在生產環境中使用而設計，可校準和測試內含 TI 光源感測器的最終產品。此穩定光源可用於模擬日落 (4200K CCT) 和中午 (6400K CCT) 照明模式。光源均勻且恆定，光輸出隨時間的變化小於 ±1%，且 1 英寸直徑區域均勻度變化小於 ±1%。照明程度和模式可透過光源 EVM GUI 調整。
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TIDA-00750 — 採用 3D 飛時測距 (ToF) 針對需求控制通風進行人數統計的參考設計
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| NFBGA (ZVM) | 256 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。
