PGA280
- Wide input range: ±15.5 V at ±18-V supply
- Binary gain steps: 128V/V to 1/8 V/V
- Additional scaling factor: 1 V/V and 1⅜ V/V
- Low offset voltage: 3 µV at G = 128
- Near-zero long-term drift of offset voltage
- Near-zero gain drift: 0.5 ppm/°C
- Excellent linearity: 1.5 ppm
- Excellent CMRR: 140 dB
- High input impedance
- Very low 1/f noise
- Differential signal output
- Overload detection
- Input configuration switch matrix
- Wire break test current
- Expandable SPI™ with checksum
- General-purpose I/O port
- TSSOP-24 package
The PGA280 is a high-precision instrumentation amplifier with digitally-controllable gain and signal integrity test capability. This device offers low offset voltage, near-zero offset and gain drift, excellent linearity, and nearly no 1/f noise with superior common-mode and supply rejection to support high-resolution precision measurement. The 36-V supply capability and wide, high-impedance input range comply with requirements for universal signal measurement.
Special circuitry prevents inrush currents from multiplexer (MUX) switching. In addition, the input switch matrix enables easy reconfiguration and system-level diagnostics—overload conditions are indicated.
The configurable general-purpose input/output (GPIO) offers several control and communication features. The SPI can be expanded to communicate with more devices, supporting isolation with only four ISO couplers. The PGA280 is available in a TSSOP-24 package and is specified from –40°C to +105°C. For all available packages, see the package option addendum at the end of the data sheet.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | PGA280 Zerø-Drift, High-Voltage, Programmable Gain Instrumentation Amplifier datasheet (Rev. B) | PDF | HTML | 2020年 4月 8日 |
Analog Design Journal | Precision signal conditioning for safety-enabled AIMs in factory automation | 2019年 9月 30日 | ||
EVM User's guide | ADS1259EVM and ADS1259EVM-PDK User's Guide (Rev. B) | 2016年 5月 14日 | ||
Application note | PGA280 Communication via SPI™ | 2009年 12月 6日 |
設計與開發
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TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 24 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點