韌體
PGA450-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range
- Dual NMOS Low-Side Drivers
- Configurable Burst Generator
- Low-Noise Amplifier
- 12-Bit SAR ADC
- Configurable Digital Bandpass Filter
- Digital Signal Envelope Detect
- On-Chip 8-Bit Microprocessor
- LIN 2.1 Physical Interface and Protocol
- Watchdog Timer
- Four-Wire SPI for Testability and Programming
- 8K Bytes of OTP
- 768 Bytes of FIFO RAM
- 256 Bytes of Scratchpad RAM
- 8K Bytes of Development RAM
- 32 Bytes of EEPROM for Application
All trademarks are the property of their respective owners.
The PGA450-Q1 device is a fully integrated system-on-a-chip analog front-end for ultrasonic sensing in automotive park-assist, object-detection through air, level sensing in large tanks, and distance measurements for anti-collision and landing assist of unmanned systems (such as drones, cameras, and robots). This highly integrated device enables a small form-factor and cost-optimized solution compared to discrete ultrasonic-sensor solutions. The PGA450-Q1 device can measure distances ranging from less than 1 meter up to 7 meters, at a resolution of 1 cm depending on the transducer-transformer sensor pair used in the system.
The PGA450-Q1 device has an integrated 8051 8-bit microcontroller and OTP memory for program storage to process the echo signal and calculate the distance between the transducer and targeted object. Full programmability is available for optimization of specific end applications, and to accommodate a wide-range of closed-top or open-top transducers. Configurable variables include the number of transmit pulses, driving frequency, LNA gain, and comparison signal thresholds. External communication with the PGA450-Q1 device is capable through the LIN 2.1 protocol, SPI, or UART interfaces.
For all available packages, see the orderable addendum at the end of the data sheet.技術文件
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檢視所有 11 | 重要文件 | 類型 | 標題 | 格式選項 | 日期 |
|---|---|---|---|---|
| * | Data sheet | PGA450-Q1 Ultrasonic-Sensor Signal Conditioner datasheet (Rev. D) | PDF | HTML | 2016年 6月 7日 |
| Application note | Ultrasonic Sensing Basics (Rev. D) | PDF | HTML | 2021年 12月 2日 | |
| Application note | PGA450-Q1 Software Development Guide | 2018年 10月 31日 | ||
| Technical article | How ultrasonic technology improves convenience and performance in home automation | PDF | HTML | 2017年 10月 5日 | |
| Technical article | Power naps: saving energy using ultrasonic sensing | PDF | HTML | 2016年 8月 16日 | |
| Application note | PGA450-Q1 Reset Issue During VPWR Ramp Down | 2016年 5月 24日 | ||
| Application note | LIN Demonstration using PGA450Q1EVM Firmware Rev 2.1 (Rev. A) | 2015年 7月 13日 | ||
| Application note | Optimizing Performance of the PGA450-Q1 | 2015年 6月 23日 | ||
| Application note | Automatic Slave Node Position Detection (SNPD) for PGA450-Q1 | 2015年 6月 17日 | ||
| Analog Design Journal | 3Q 2012 Issue Analog Applications Journal | 2012年 7月 17日 | ||
| Analog Design Journal | Using a fixed threshold in ultrasonic distance-ranging automotive applications | 2012年 7月 17日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
開發板
PGA450Q1EVM — PGA450Q1EVM - 超音波 IC 感測器訊號調節器評估模組
This evaluation module features a PGA450-Q1 device which is a system on Chip (SOC) sensor interface IC for automotive ultrasonic sensors. It provides all signal conditioning and processing for the transducer echo signals and for calculating the distance between the transducer and objects. MCU and (...)
開發模組 (EVM) 的 GUI
SLDC008 — PGA450Q1EVM GUI v1.50.3
支援產品和硬體
參考設計
TIDA-00151 — 適用於停車輔助或盲點偵測系統的車用超音波感測器介面 IC
TIDA-00151 參考設計包含一個 PGA450-Q1，這是一款適用於汽車超音波感測器的系統單晶片 (SOC) 感測器介面 IC。它提供所有感測器回波訊號的訊號調整與處理功能，並用於計算感測器與物體之間的距離。MCU 和程式記憶體可針對特定終端應用進行完整配置。
應用範例包括超音波停車輔助、自動停車，盲點偵測和代客停車。
此設計包括小型電路板的設計文檔，但使用 PGA450Q1EVM 電路板來收集測試資料。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| TSSOP (PW) | 28 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。