SN74LV4T86-EP
- Wide operating range of 1.8 V to 5.5 V
-
Single-supply voltage translator (refer to LVxT Enhanced Input Voltage):
-
Up translation:
- 1.2 V to 1.8 V
- 1.5 V to 2.5 V
- 1.8 V to 3.3 V
- 3.3 V to 5.0 V
-
Down translation:
- 5.0 V, 3.3 V, 2.5 V to 1.8 V
- 5.0 V, 3.3 V to 2.5 V
- 5.0 V to 3.3 V
-
- 5.5-V tolerant input pins
- Supports standard pinouts
- Up to 150Mbps with 5-V or 3.3-V V CC
- Latch-up performance exceeds 250 mA per JESD 17
- Supports defense, aerospace, and medical applications:
- Controlled baseline
- One assembly and test site
- One fabrication site
- Extended product life cycle
- Product traceability
The SN74LV4T86-EP contains four independent 2-input XOR Gates with Schmitt-trigger inputs with extended voltage operation to allow for level translation. Each gate performs the Boolean function Y = A ⊕ B in positive logic. The output level is referenced to the supply voltage (V CC) and supports 1.2-V, 1.8-V, 2.5-V, 3.3-V, and 5-V CMOS levels.
The input is designed with a lower threshold circuit to support up translation for lower voltage CMOS inputs (for example 1.2 V input to 1.8 V output or 1.8 V input to 3.3 V output). Additionally, the 5-V tolerant input pins enable down translation (for example 3.3 V to 2.5 V output).
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | SN74LV4T86-EPEnhanced Product, Quadruple 2-Input Exclusive-OR Gates datasheet | PDF | HTML | 2023年 11月 15日 |
* | Radiation & reliability report | SN74LV4T86-EP Enhanced Product Qualification and Reliability Report | PDF | HTML | 2023年 11月 22日 |
設計與開發
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14-24-LOGIC-EVM — 適用於 14 針腳至 24 針腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產品通用評估模組
14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。
14-24-NL-LOGIC-EVM — 適用於 14 針腳至 24 針腳無引線封裝的邏輯產品通用評估模組
14-24-NL-LOGIC-EVM 是一款靈活的評估模組 (EVM),設計用途可支援任何具有 14 針腳至 24 針腳 BQA、BQB、RGY、RSV、RJW 或 RHL 封裝的邏輯或轉換裝置。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 14 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點