SN74LVC2G53
- Available in the Texas Instruments
NanoFree™ Package - 1.65-V to 5.5-V VCC Operation
- High On-Off Output Voltage Ratio
- High Degree of Linearity
- High Speed, Typically 0.5 ns (VCC = 3 V,
CL = 50 pF) - Low ON-State Resistance, Typically 6.5 Ω
(VCC = 4.5 V) - Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
This single 2:1 analog multiplexer/demultiplexer is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G53 device can handle both analog and digital signals. This device permits signals with amplitudes of up to 5.5 V (peak) to be transmitted in either direction.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.
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開發板
DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
使用指南: PDF
開發板
TL16C750EEVM — TL16C750E 128 位元組 FIFO 分數傳輸速率 UART 評估模組
This EVM provides the user with the ability to evaluate the TL16C750E device and its features. The EVM includes an onboard 3.3-V LDO as well as level translation for processors which operate at a higher voltage rail.
使用指南: PDF
介面轉接器
LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
使用指南: PDF
介面轉接器
LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
使用指南: PDF
參考設計
TIDA-01022 — 適用於 DSO、雷達和 5G 無線測試系統的靈活 3.2-GSPS 多通道 AFE 參考設計
This high speed multi-channel data capture reference design enables optimum system performance. System designers needs to consider critical design parameters like clock jitter and skew for high speed multi-channel clock generation, which affects overall system SNR, SFDR, channel to channel skew (...)
參考設計
TIDA-01023 — 適用於雷達和 5G 無線測試器的高通道計數 JESD204B 時鐘產生參考設計
High-speed multi-channel applications require low noise and scalable clocking solutions capable of precise channel-to-channel skew adjustment to achieve optimal system SNR, SFDR, and ENOB. This reference design supports high channel count JESD204B synchronized clocks using one master and multiple (...)
參考設計
TIDA-01024 — 適用於雷達和 5G 無線測試器的高通道計數 JESD204B 菊輪鍊時鐘參考設計
High-speed multi-channel applications require low noise and scalable clocking solutions capable of precise channel-to-channel skew adjustment to achieve optimal system SNR, SFDR, and ENOB. This reference design supports scaling up JESD204B synchronized clocks in daisy chain configuration. This (...)
參考設計
TIDA-01027 — 在 12.8 GSPS 資料採集系統中發揮最大效能的低雜訊電源供應參考設計
This reference design demonstrates an efficient, low-noise five-rail power supply design for very high-speed Data Acquisition (DAQ) systems capable of > 12.8 GSPS. The power supply DC/DC converters are frequency-synchronized and phase-shifted in order to minimize input current ripple and (...)
參考設計
TIDA-01028 — 適用於高速示波器和寬頻帶數位器的 12.8-GSPS 類比前端參考設計
This reference design provides a practical example of interleaved RF-sampling analog-to-digital converters (ADCs) to achieve a 12.8-GSPS sampling rate. This is done by time interleaving two RF-sampling ADCs. Interleaving requires a phase shift between the ADCs, which this reference design achieves (...)
參考設計
TIDA-010128 — 適用於 12 位元數位器的可擴充 20.8 GSPS 參考設計
This reference design describes a 20.8 GSPS sampling system using RF sampling analog-to-digital converters (ADCs) in time interleaved configuration. Time interleaving method is a proven and traditional way of increasing sample rate, however, matching individual ADCs offset, gain and sampling time (...)
參考設計
TIDA-010122 — 適用於多通道射頻系統的參考設計同步數據轉換器 DDC 和 NCO 功能
此參考設計可解決與新興 5G 適配應用相關，例如大規模多輸入多輸出 (mMIMO)、相位陣列雷達與通訊酬載等應用相關的同步設計挑戰。一般 RF 前端包含天線、低雜訊放大器 (LNA)、混波器、類比網域中的本地振盪器 (LO) 及類比轉數位轉換器、數值控制振盪器 (NCO) 和數位降轉換器 (DDC)。為了達到整體系統同步化，這些數位區塊必須與系統時鐘同步。本參考設計採用 ADC12DJ3200 資料轉換器，透過同步處理晶片內建 NCO 與 SYNC ~ 並使用無雜訊孔徑延遲調整 (tAD 調整) 功能，在多個接收器之間達到小於 5-ps 的頻道間偏斜的效果，以進一步降低偏斜。此設計也具備搭載 (...)
參考設計
TIDA-010131 — 適用於雷達和無線 5G 測試儀的多通道射頻收發器計時參考設計
Analog front end for high-speed end equipments like phased-array radars, wireless communication testers, and electronic warfare require synchronized, multipletransceiver signal chains. Each transceiver signal chain includes high-speed, analog-to-digital converters (ADCs), digital-to-analog (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| DSBGA (YZP) | 8 | Ultra Librarian |
| SSOP (DCT) | 8 | Ultra Librarian |
| VSSOP (DCU) | 8 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。