SN74LVC2G86
- Available in the Texas Instruments NanoFree Package
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Max tpd of 4.7 ns at 3.3 V
- Low Power Consumption, 10-μA Max ICC
- ±24-mA Output Drive at 3.3 V
- Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C - Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C - Ioff Supports Live Insertion, Partial-Power-Down Mode and Back Drive Protection
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
This dual 2-input exclusive-OR gate is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G86 performs the Boolean function Y = A ⊕ B or Y = AB + AB in positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
A common application is as a true/complement element. If the input is low, the other input is reproduced in true form at the output. If the input is high, the signal on the other input is reproduced inverted at the output.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
An exclusive-OR gate has many applications, some of which can be represented better by alternative logic symbols.
您可能會感興趣的類似產品
引腳對引腳且具備與所比較裝置相同的功能
技術文件
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
5-8-LOGIC-EVM — 適用於 5 針腳至 8 針腳 DCK、DCT、DCU、DRL 和 DBV 封裝的通用邏輯評估模組
TIDA-00548 — 適用於安全應用的 4-20mA 類比輸入模組參考設計
TIDA-01552 — 適用於數位輸出模組的八通道 2A 高壓側驅動器參考設計
TIDA-01333 — 採用 ISOW7841 的八通道隔離式高電壓類比輸入模組參考設計
TIDA-00550 — 適用於 PLC 的雙通道轉通道隔離式通用類比輸入模組參考設計
TIDA-00560 — 適用於 PLC 模組的 16 通道狀態 LED 驅動器參考設計
TIDA-00764 — 八通道隔離式高電壓類比輸入模組參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
DSBGA (YZP) | 8 | Ultra Librarian |
SSOP (DCT) | 8 | Ultra Librarian |
VSSOP (DCU) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點