THS4541-DIE
- Bandwidth: 500 MHz (G = 2 V/V)
- Gain bandwidth product: 850 MHz
- Slew rate: 1500 V/µs
- HD2: –95 dBc at 10 MHz (2 VPP, RL = 500 Ω)
- HD3: –90 dBc at 10 MHz (2 VPP, RL = 500 Ω)
- Input voltage noise: 2.2 nV/ √Hz (f > 100 kHz)
- Low offset drift: ±0.5 µV/°C (typical)
- Negative rail input (NRI)
- Rail-to-rail output (RRO)
- Power supply:
- Single-supply voltage range: 2.7 V to 5.4 V
- Split-supply voltage range: ±1.35 V to ±2.7 V
- Quiescent current: 10.1 mA (5-V supply)
- Power-down capability: 2 µA (typical)
The THS4541-DIE is a low-power, voltage-feedback, fully differential amplifier (FDA) with an input common-mode range below the negative rail, and rail-to-rail output. This is a bare die product that can be used in multi-chip modules (MCM), system-in-package (SiP), chip-on-board (COB), hybrids, and systems that require an extremely small size. The THS4541-DIE is designed for low-power data acquisition systems where high density is critical in a high-performance analog-to-digital converter (ADC) or digital-to-analog converter (DAC) interface design.
The THS4541-DIE features the negative-rail input required when interfacing a DC-coupled, ground-centered, source signal. This negative-rail input, with rail-to-rail output, allows for easy interface between single-ended, ground-referenced, bipolar signal sources and a wide variety of successive approximation register (SAR), delta-sigma (ΔΣ), or pipeline ADCs using only a single 2.7 V to 5.4 V power supply.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | THS4541-DIE Negative Rail Input, Rail-to-Rail Output, Precision, 850-MHz Fully Differential Amplifier datasheet (Rev. A) | PDF | HTML | 2022年 3月 11日 |
Application note | Noise Analysis for High Speed Op Amps (Rev. A) | 2005年 1月 17日 |
設計與開發
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THS4541RGTEVM — 採用 RGT 封裝的 THS4541 評估模組
The THS4541RGT EVM is an evaluation module for the single THS4541 amplifier in the RGT package. This evaluation module is designed to quickly and easily demonstrate the functionality and versatility of the amplifier. The EVM is ready to connect to power, signal source, and test instruments (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
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DIESALE (Y) | — |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點