TPA6304-Q1
- Highest efficiency Class-D
- Significantly more efficient than Class-AB
- Reduce thermal solution with 75% less heat dissipation than Class-AB
- Start/stop operation down to 4.5 V
- AEC-Q100 Qualified for automotive applications:
- Temperature grade 1: –40°C to 125°C TA
- HBM ESD Classification level 2
- CDM ESD Classification level C2B
- 27 W, 10% THD into 4 Ω at 14.4 V
- Drives 4 Ω and 2 Ω loads
- Load diagnostics
- Output open, shorted load
- Output-to-battery or ground shorts
- Tweeter connected
- Designed with advanced gate drive to meet CISPR25-L5 EMC specification
- Class-D at 2.1 MHz, no AM interference
- Spread Spectrum mode, Phase Offset, Slew Rate Control
- Protection
- 40 V Load dump
- Output short protection
- DC offset and over temperature
- Fortuitous open ground and power tolerant
- Audio inputs
- 4 Channel single-ended analog input
- 10 dB, 16 dB, 22 dB or 28 dB Gain option
- Supports parallel channel drive (PBTL)
- Audio performance into 4 Ω at 14.4 V, 1 kHz
- THD+N < 0.006%
- 42 µVRMS Output Noise
- 80 dB PSRR
- Efficiency > 80%
- Special features
- Programmable clip detection
- Load current limiter
- Thermal gain foldback
- Fast and autonomous startup diagnostics
- AC load impedance measurement with < 10 mA load current
The TPA6304-Q1 device is a four-channel analog-input Class-D Burr-Brown™ audio amplifier that implements a 2.1 MHz PWM switching frequency that enables a cost optimized solution in a very small 2.7 cm2 PCB size, high impedance single ended inputs and full operation down to 4.5 V for start/stop events.
The TPA6304-Q1 Class-D audio amplifier has an optimal design for use in entry level automotive head units that provide analog audio input signals as part of their system design. The Class-D topology dramatically improves efficiency over traditional linear amplifier solutions.
The output switching frequency can be set either above the AM band, which eliminates the AM band interference and reduces output filter size and cost, or below AM band to further optimize efficiency.
The device is offered in a 44 pin HTSSOP package with the exposed thermal pad up.
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HTSSOP (DDV) | 44 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
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