SN74LVT162240

ACTIVO

Inversores de 16 canales, 2.7 V a 3.6 V con entradas CMOS compatibles con TTL y salidas de 3 estados

Detalles del producto

Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 12 IOH (max) (mA) -12 Supply current (max) (µA) 5000 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Damping resistors, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 12 IOH (max) (mA) -12 Supply current (max) (µA) 5000 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Damping resistors, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
  • Members of the Texas Instruments Widebus™ Family
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation
  • Output Ports Have Equivalent 22- Series Resistors, So No External Resistors Are Required
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

Widebus is a trademark of Texas Instruments.

  • Members of the Texas Instruments Widebus™ Family
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation
  • Output Ports Have Equivalent 22- Series Resistors, So No External Resistors Are Required
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

Widebus is a trademark of Texas Instruments.

The 'LVT162240 devices are 16-bit buffers/drivers designed specifically for low-voltage (3.3-V) VCC operation and to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. They have the capability to provide a TTL interface to a 5-V system environment.

These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer and provide inverting outputs and symmetrical active-low output-enable (OE) inputs.

The outputs, which are designed to source or sink up to 12 mA, include equivalent 22- series resistors to reduce overshoot and undershoot.

When VCC, is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

The SN54LVT162240 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT162240 is characterized for operation from -40°C to 85°C.

The 'LVT162240 devices are 16-bit buffers/drivers designed specifically for low-voltage (3.3-V) VCC operation and to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. They have the capability to provide a TTL interface to a 5-V system environment.

These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer and provide inverting outputs and symmetrical active-low output-enable (OE) inputs.

The outputs, which are designed to source or sink up to 12 mA, include equivalent 22- series resistors to reduce overshoot and undershoot.

When VCC, is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

The SN54LVT162240 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT162240 is characterized for operation from -40°C to 85°C.

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Documentación técnica

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Tipo Título Fecha
* Data sheet 3.3-V ABT 16-Bit Buffers/Drivers With 3-State Outputs datasheet (Rev. A) 28 nov 2006
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 may 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 may 2002
Selection guide Advanced Bus Interface Logic Selection Guide 09 ene 2001
Application note LVT-to-LVTH Conversion 08 dic 1998
Application note LVT Family Characteristics (Rev. A) 01 mar 1998
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 ago 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 may 1996

Diseño y desarrollo

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Modelo de simulación

SN74LVT162240 Behavioral SPICE Model

SCBM120.ZIP (7 KB) - PSpice Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
SSOP (DL) 48 Ultra Librarian
TSSOP (DGG) 48 Ultra Librarian
TVSOP (DGV) 48 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
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  • Lugar de fabricación
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