TXS0102

ACTIVO

Conmutador de nivel de tensión bidireccional de 2 bit para aplicaciones de drenaje abierto e inserci

Detalles del producto

Technology family TXS Applications I2C, MDIO Bits (#) 2 Data rate (max) (Mbps) 24 High input voltage (min) (V) 1.45 High input voltage (max) (V) 5.5 Vout (min) (V) 1.65 Vout (max) (V) 5.5 IOH (max) (mA) 0 IOL (max) (mA) 0 Supply current (max) (µA) 10 Features Edge rate accelerator, Output enable, Partial power down (Ioff), Vcc isolation Input type Transmission Gate Output type 3-State, Transmission Gate Rating Catalog Operating temperature range (°C) -40 to 85
Technology family TXS Applications I2C, MDIO Bits (#) 2 Data rate (max) (Mbps) 24 High input voltage (min) (V) 1.45 High input voltage (max) (V) 5.5 Vout (min) (V) 1.65 Vout (max) (V) 5.5 IOH (max) (mA) 0 IOL (max) (mA) 0 Supply current (max) (µA) 10 Features Edge rate accelerator, Output enable, Partial power down (Ioff), Vcc isolation Input type Transmission Gate Output type 3-State, Transmission Gate Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YZP) 8 2.8125 mm² 2.25 x 1.25 SSOP (DCT) 8 11.8 mm² 2.95 x 4 VSSOP (DCU) 8 6.2 mm² 2 x 3.1 X2SON (DQE) 8 1.4 mm² 1.4 x 1 X2SON (DQM) 8 2.16 mm² 1.8 x 1.2
  • No direction-control signal needed
  • Maximum data rates:
    • 24 Mbps (push pull)
    • 2 Mbps (open drain)
  • Available in the Texas Instruments NanoStar™ integrated circuit package
  • 1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on B port (V CCA ≤ V CCB)
  • V CC isolation feature: if either V CC input is at GND, both ports are in the High-Impedance state
  • No power-supply sequencing required: either V CCA or V CCB can be ramped first
  • I off supports partial-power-down mode operation
  • Latch-up performance exceeds 100 mA per JESD 78, Class II
  • ESD protection exceeds JESD 22:
    • A port:
      • 2500-V Human-Body Model (A114-B)
      • 250-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)
    • B port:
      • 8-kV Human-Body Model (A114-B)
      • 250-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)
  • No direction-control signal needed
  • Maximum data rates:
    • 24 Mbps (push pull)
    • 2 Mbps (open drain)
  • Available in the Texas Instruments NanoStar™ integrated circuit package
  • 1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on B port (V CCA ≤ V CCB)
  • V CC isolation feature: if either V CC input is at GND, both ports are in the High-Impedance state
  • No power-supply sequencing required: either V CCA or V CCB can be ramped first
  • I off supports partial-power-down mode operation
  • Latch-up performance exceeds 100 mA per JESD 78, Class II
  • ESD protection exceeds JESD 22:
    • A port:
      • 2500-V Human-Body Model (A114-B)
      • 250-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)
    • B port:
      • 8-kV Human-Body Model (A114-B)
      • 250-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)

This two-bit non-inverting translator is a bidirectional voltage-level translator and can be used to establish digital switching compatibility between mixed-voltage systems. It uses two separate configurable power-supply rails, with the A ports supporting operating voltages from 1.65 V to 3.6 V while it tracks the V CCA supply, and the B ports supporting operating voltages from 2.3 V to 5.5 V while it tracks the V CCB supply. This allows the support of both lower and higher logic signal levels while providing bidirectional translation capabilities between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.

When the output-enable (OE) input is low, all I/Os are placed in the high-impedance state, which significantly reduces the power-supply quiescent current consumption.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

This two-bit non-inverting translator is a bidirectional voltage-level translator and can be used to establish digital switching compatibility between mixed-voltage systems. It uses two separate configurable power-supply rails, with the A ports supporting operating voltages from 1.65 V to 3.6 V while it tracks the V CCA supply, and the B ports supporting operating voltages from 2.3 V to 5.5 V while it tracks the V CCB supply. This allows the support of both lower and higher logic signal levels while providing bidirectional translation capabilities between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.

When the output-enable (OE) input is low, all I/Os are placed in the high-impedance state, which significantly reduces the power-supply quiescent current consumption.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

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Documentación técnica

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* Data sheet TXS0102 2-Bit Bidirectional Voltage-Level Translator for Open-Drain and Push-Pull Applications datasheet (Rev. J) PDF | HTML 25 jul 2023
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 12 jul 2024
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 03 jul 2024
Application brief Integrated vs. Discrete Open Drain Level Translation PDF | HTML 09 ene 2024
Application note Leveraging Edge Rate Accelerators with Auto-Sensing Level Shifters PDF | HTML 29 sep 2023
Application brief Future-Proofing Your Level Shifter Design with TI's Dual Footprint Packages PDF | HTML 05 sep 2023
Application note Do’s and Don’ts for TXB and TXS Voltage Level-Shifters with Edge Rate Accelerato PDF | HTML 28 jun 2023
Product overview Enabling System on Module Industrial PC Connectivity With Level Translation PDF | HTML 03 abr 2023
Application brief Enabling Next Generation Processors, FPGA, and ASSP with Voltage Level Translat PDF | HTML 17 ene 2023
Application brief Enabling Smart Solar Inverter Designs with Level Translation PDF | HTML 31 oct 2022
Product overview Translate Voltages for I2C for PCA9306 LSF0102 TXS0102 PDF | HTML 14 sep 2022
Product overview Translate Voltages for I2C PDF | HTML 02 jun 2022
Application brief Translate Voltages for MDIO PDF | HTML 16 jul 2021
EVM User's guide TXS-EVM User's Guide (Rev. B) PDF | HTML 08 jun 2021
Selection guide Voltage Translation Buying Guide (Rev. A) 15 abr 2021
Technical article How smart thermostats get their degrees PDF | HTML 09 mar 2020
Application note Effects of pullup and pulldown resistors on TXS and TXB devices (Rev. A) 28 mar 2018
Application note Factors Affecting VOL for TXS and LSF Auto-bidirectional Translation Devices 19 nov 2017
Application note Biasing Requirements for TXS, TXB, and LSF Auto-Bidirectional Translators 30 oct 2017
Application note A Guide to Voltage Translation With TXS-Type Translators 29 jun 2010

Diseño y desarrollo

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Placa de evaluación

5-8-LOGIC-EVM — Módulo de evaluación lógica genérico para encapsulados DCK, DCT, DCU, DRL y DBV de 5 a 8 pines

Módulo de evaluación (EVM) flexible diseñado para admitir cualquier dispositivo que tenga un encapsulado DCK, DCT, DCU, DRL o DBV en un recuento de 5 a 8 pines.
Guía del usuario: PDF
Placa de evaluación

TXS-EVM — Módulo de evaluación de la familia de conversores para dispositivos de canal único, doble, cuádruple

El módulo de evaluación (EVM) TXS está diseñado para admitir dispositivos TXS de canal simple, doble, cuádruple y octal. Los dispositivos TXS pertenecen a la familia de traducción de nivel de tensión bidireccional automática con una tensión de funcionamiento entre 1.2 V y 5.5 V diseñada para (...)

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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
DSBGA (YZP) 8 Ultra Librarian
SSOP (DCT) 8 Ultra Librarian
VSSOP (DCU) 8 Ultra Librarian
X2SON (DQE) 8 Ultra Librarian
X2SON (DQM) 8 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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