LP8754
- Six High-Efficiency Step-Down DC/DC Converter Cores:
- Max Output Current 10 A
- Cores Bundled to a 6-Phase Converter
- Load Current Reporting
- Programmable Overcurrent Protection (OCP)
- Auto PWM/PFM and Forced-PWM Operations and
Automatic Low Power-Mode Setting - Automatic Phase Adding/Shedding
- Remote Differential Feedback Voltage Sensing
- Output Voltage Ramp Control
- VOUT Range = 0.6 V to 1.67 V
- I2C-Compatible Interface which Supports
Standard (100 kHz), Fast (400 kHz), and High-Speed
(3.4 MHz) Modes - Four Selectable I2C Addresses
- Interrupt Function with Programmable Masking
- Output Short-Circuit and Input Overvoltage
Protection (OVP) - Spread Spectrum and Phase Control for EMI
Reduction - Overtemperature Protection (OTP)
- Undervoltage Lock-out (UVLO)
The LP8754 is designed to meet the power management requirements of the latest applications processors in mobile phones and similar portable applications. The device contains six step-down DC/DC converter cores, which are bundled together in a 6-phase buck converter. The device is fully controlled by a Dynamic Voltage Scaling (DVS) interface or an I2C-compatible serial interface.
The automatic PWM/PFM operation together with the automatic phase adding/shedding maximizes efficiency over a wide output current range. The LP8754 supports remote differential voltage sensing to compensate IR drop between the regulator output and the point-of-load thus improving the accuracy of the output voltage.
The protection features include short-circuit protection, current limits, input OVP, UVLO, temperature warning, and shutdown functions. Several error flags are provided for status information of the IC. In addition, I2C read-back includes total load current and load current for each buck core: The LP8754 has the ability to sense current being delivered to the load without the addition of current sense resistors. During start-up, the device controls the output voltage slew rate to minimize overshoot and the inrush current.
For all available packages, see the orderable addendum at the end of the datasheet.技術資料
設計および開発
その他のアイテムや必要なリソースを参照するには、以下のタイトルをクリックして詳細ページをご覧ください。
パッケージ | ピン数 | CAD シンボル、フットプリント、および 3D モデル |
---|---|---|
DSBGA (YFQ) | 49 | Ultra Librarian |
購入と品質
- RoHS
- REACH
- デバイスのマーキング
- リード端子の仕上げ / ボールの原材料
- MSL 定格 / ピーク リフロー
- MTBF/FIT 推定値
- 使用原材料
- 認定試験結果
- 継続的な信頼性モニタ試験結果
- ファブの拠点
- 組み立てを実施した拠点