홈 마이크로컨트롤러(MCU) 및 프로세서 Arm 기반 프로세서
홈
마이크로컨트롤러(MCU) 및 프로세서
Arm 기반 프로세서

66AK2H14

활성

고성능 멀티코어 DSP+Arm - 4x Arm A15 코어, 8x C66x DSP 코어, 10GbE

지금 주문
데이터 시트
정오표

66AK2H14

활성
데이터 시트 지금 주문

제품 상세 정보

Arm CPU 4 Arm Cortex-A15 Arm (max) (MHz) 1200, 1400 Coprocessors C66x DSP CPU 32-bit Protocols Ethernet Ethernet MAC 10G Ethernet PCIe 2 PCIe Gen 2 Hardware accelerators Packet Accelerator, Security Accelerator Features Networking Operating system Linux, RTOS Security Cryptography, Device identity, Secure boot Rating Catalog Operating temperature range (°C) -40 to 100
Arm CPU 4 Arm Cortex-A15 Arm (max) (MHz) 1200, 1400 Coprocessors C66x DSP CPU 32-bit Protocols Ethernet Ethernet MAC 10G Ethernet PCIe 2 PCIe Gen 2 Hardware accelerators Packet Accelerator, Security Accelerator Features Networking Operating system Linux, RTOS Security Cryptography, Device identity, Secure boot Rating Catalog Operating temperature range (°C) -40 to 100
FCBGA (AAW) 1517 1600 mm² 40 x 40
  • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With
    • 1.0 GHz or 1.2 GHz C66x Fixed- and Floating-Point DSP Core
      • 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
      • 19.2 GFlops/Core for Floating Point @ 1.2 GHz
    • Memory
      • 32-KB L1P Per CorePac
      • 32-KB L1D Per CorePac
      • 1024-KB Local L2 Per CorePac
  • ARM CorePac
    • Four ARM® Cortex®-A15 MPCore™ Processors at up to 1.4 GHz
    • 4MB of L2 Cache Memory Shared by Four ARM Cores
    • Full Implementation of ARMv7-A Architecture Instruction Set
    • 32-KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE) Master Port, Connected to MSMC for Low-Latency Access to Shared MSMC SRAM
  • Multicore Shared Memory Controller (MSMC)
    • 6MB of MSM SRAM Memory Shared by Eight DSP CorePacs and One ARM CorePac
    • Memory Protection Unit (MPU) for Both MSM SRAM and DDR3_EMIF
  • Multicore Navigator
    • 16k Multipurpose Hardware Queues With Queue Manager
    • Packet-Based DMA for Zero-Overhead Transfers
  • Network Coprocessor
    • Packet Accelerator Enables Support for
      • Transport Plane IPsec, GTP-U, SCTP, PDCP
      • L2 User Plane PDCP (RoHC, Air Ciphering)
      • 1-Gbps Wire Speed Throughput at 1.5 MPackets Per Second
    • Security Accelerator Engine Enables Support for
      • IPSec, SRTP, 3GPP, and WiMAX Air Interface, and SSL/TLS Security
      • ECB, CBC, CTR, F8, A5/3, CCM, GCM, HMAC, CMAC, GMAC, AES, DES, 3DES, Kasumi, SNOW 3G, SHA-1, SHA-2 (256-Bit Hash), MD5
      • Up to 2.4 Gbps IPSec and 2.4 Gbps Air Ciphering
    • Ethernet Subsystem
      • Five-Port Switch (Four SGMII Ports)
  • Peripherals
    • Four Lanes of SRIO 2.1
      • Supports up to 5 GBaud
      • Supports Direct I/O, Message Passing
    • Two Lanes PCIe Gen2
      • Supports up to 5 GBaud
    • Two HyperLinks
      • Supports Connections to Other KeyStone™ Architecture Devices Providing Resource Scalability
      • Supports up to 50 GBaud
    • 10-Gigabit Ethernet (10-GbE) Switch Subsystem (66AK2H14 Only)
      • Two XFI Ports
      • IEEE 1588 Support
    • Five Enhanced Direct Memory Access (EDMA) Modules
    • Two 72-Bit DDR3/DDR3L Interfaces With Speeds up to 1600 MHz
    • EMIF16 Interface
    • USB 3.0
    • Two UART Interfaces
    • Three I2C Interfaces
    • 32 GPIO Pins
    • Three SPI Interfaces
    • Semaphore Module
    • 64-Bit Timers
      • Twenty 64-Bit Timers for 66AK2H14 and 66AK2H12
      • Fourteen 64-Bit Timers for 66AK2H06
    • Five On-Chip PLLs
  • Commercial Case Temperature:
    • 0ºC to 85ºC
  • Extended Case Temperature:
    • –40ºC to 100ºC
  • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With
    • 1.0 GHz or 1.2 GHz C66x Fixed- and Floating-Point DSP Core
      • 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
      • 19.2 GFlops/Core for Floating Point @ 1.2 GHz
    • Memory
      • 32-KB L1P Per CorePac
      • 32-KB L1D Per CorePac
      • 1024-KB Local L2 Per CorePac
  • ARM CorePac
    • Four ARM® Cortex®-A15 MPCore™ Processors at up to 1.4 GHz
    • 4MB of L2 Cache Memory Shared by Four ARM Cores
    • Full Implementation of ARMv7-A Architecture Instruction Set
    • 32-KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE) Master Port, Connected to MSMC for Low-Latency Access to Shared MSMC SRAM
  • Multicore Shared Memory Controller (MSMC)
    • 6MB of MSM SRAM Memory Shared by Eight DSP CorePacs and One ARM CorePac
    • Memory Protection Unit (MPU) for Both MSM SRAM and DDR3_EMIF
  • Multicore Navigator
    • 16k Multipurpose Hardware Queues With Queue Manager
    • Packet-Based DMA for Zero-Overhead Transfers
  • Network Coprocessor
    • Packet Accelerator Enables Support for
      • Transport Plane IPsec, GTP-U, SCTP, PDCP
      • L2 User Plane PDCP (RoHC, Air Ciphering)
      • 1-Gbps Wire Speed Throughput at 1.5 MPackets Per Second
    • Security Accelerator Engine Enables Support for
      • IPSec, SRTP, 3GPP, and WiMAX Air Interface, and SSL/TLS Security
      • ECB, CBC, CTR, F8, A5/3, CCM, GCM, HMAC, CMAC, GMAC, AES, DES, 3DES, Kasumi, SNOW 3G, SHA-1, SHA-2 (256-Bit Hash), MD5
      • Up to 2.4 Gbps IPSec and 2.4 Gbps Air Ciphering
    • Ethernet Subsystem
      • Five-Port Switch (Four SGMII Ports)
  • Peripherals
    • Four Lanes of SRIO 2.1
      • Supports up to 5 GBaud
      • Supports Direct I/O, Message Passing
    • Two Lanes PCIe Gen2
      • Supports up to 5 GBaud
    • Two HyperLinks
      • Supports Connections to Other KeyStone™ Architecture Devices Providing Resource Scalability
      • Supports up to 50 GBaud
    • 10-Gigabit Ethernet (10-GbE) Switch Subsystem (66AK2H14 Only)
      • Two XFI Ports
      • IEEE 1588 Support
    • Five Enhanced Direct Memory Access (EDMA) Modules
    • Two 72-Bit DDR3/DDR3L Interfaces With Speeds up to 1600 MHz
    • EMIF16 Interface
    • USB 3.0
    • Two UART Interfaces
    • Three I2C Interfaces
    • 32 GPIO Pins
    • Three SPI Interfaces
    • Semaphore Module
    • 64-Bit Timers
      • Twenty 64-Bit Timers for 66AK2H14 and 66AK2H12
      • Fourteen 64-Bit Timers for 66AK2H06
    • Five On-Chip PLLs
  • Commercial Case Temperature:
    • 0ºC to 85ºC
  • Extended Case Temperature:
    • –40ºC to 100ºC

The 66AK2Hxx platform combines the quad ARM Cortex-A15 processor with up to eight TMS320C66x high-performance DSPs using the KeyStone II architecture. The 66AK2H14/12/06 device provides up to 5.6 GHz of ARM and 9.6 GHz of DSP processing coupled with security, packet processing, and Ethernet switching at lower power than multichip solutions. The 66AK2H14/12/06 device is optimal for embedded infrastructure applications like cloud computing, media processing, high-performance computing, transcoding, security, gaming, analytics, and virtual desktop.

The C66x core combines fixed-point and floating-point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). The C66x is also 100% backward compatible with software for C64x+ devices. The C66x core incorporates 90 new instructions targeted for floating point (FPi) and vector math oriented (VPi) processing.

The 66AK2H14/12/06 device has a complete set of development tools that includes: a C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.

The 66AK2Hxx platform combines the quad ARM Cortex-A15 processor with up to eight TMS320C66x high-performance DSPs using the KeyStone II architecture. The 66AK2H14/12/06 device provides up to 5.6 GHz of ARM and 9.6 GHz of DSP processing coupled with security, packet processing, and Ethernet switching at lower power than multichip solutions. The 66AK2H14/12/06 device is optimal for embedded infrastructure applications like cloud computing, media processing, high-performance computing, transcoding, security, gaming, analytics, and virtual desktop.

The C66x core combines fixed-point and floating-point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). The C66x is also 100% backward compatible with software for C64x+ devices. The C66x core incorporates 90 new instructions targeted for floating point (FPi) and vector math oriented (VPi) processing.

The 66AK2H14/12/06 device has a complete set of development tools that includes: a C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.

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82개 모두 보기
유형 직함 날짜
* Data sheet 66AK2Hxx Multicore DSP+ARM® KeyStone II System-on-Chip (SoC) datasheet (Rev. G) PDF | HTML 2017/10/09
* Errata 66AK2Hxx Multicore DSP+ARM KeyStone II SOC Errata (Revs 1.0, 1.1, 2.0, 3.0, 3.1) (Rev. F) 2018/06/05
User guide ARM Assembly Language Tools v20.2.0.LTS User's Guide (Rev. Z) PDF | HTML 2023/03/30
User guide ARM Optimizing C/C++ Compiler v20.2.0.LTS User's Guide (Rev. W) PDF | HTML 2023/03/30
Application note DDR3 Design Requirements for KeyStone Devices (Rev. D) PDF | HTML 2022/07/07
Application note Introduction to HVDC Architecture and Solutions for Control and Protection (Rev. B) PDF | HTML 2021/09/07
Application note Keystone Error Detection and Correction EDC ECC (Rev. A) 2021/06/25
Application note How to Migrate CCS 3.x Projects to the Latest CCS (Rev. A) PDF | HTML 2021/05/19
Application note Implementing an FTP Server on TI 66AK2H Device With RTOS PDF | HTML 2020/08/17
Application note Using DSPLIB FFT Implementation for Real Input and Without Data Scaling PDF | HTML 2019/06/11
Application note Using Arm ROM Bootloader on Keystone II Devices PDF | HTML 2019/06/04
User guide ARM Assembly Language Tools v19.6.0.STS User's Guide (Rev. X) 2019/06/03
User guide ARM Optimizing C/C++ Compiler v19.6.0.STS User's Guide (Rev. U) 2019/06/03
Application note Keystone Multicore Device Family Schematic Checklist PDF | HTML 2019/05/17
Application note KeyStone II DDR3 interface bring-up 2019/03/07
User guide ARM Assembly Language Tools v18.12.0.LTS User's Guide (Rev. W) 2018/11/19
User guide ARM Optimizing C/C++ Compiler v18.12.0.LTS User's Guide (Rev. T) 2018/11/19
White paper Designing professional audio mixers for every scenario 2018/06/28
User guide ARM Assembly Language Tools v18.1.0.LTS User's Guide (Rev. U) 2018/01/16
User guide ARM Optimizing C/C++ Compiler v18.1.0.LTS User's Guide (Rev. R) 2018/01/16
User guide ARM Assembly Language Tools v17.9.0.STS User's Guide (Rev. T) 2017/09/30
User guide ARM Optimizing C/C++ Compiler v17.9.0.STS User's Guide (Rev. Q) 2017/09/30
User guide KeyStone II Architecture Universal Serial Bus 3.0 (USB 3.0) (Rev. A) 2017/08/21
Application note Thermal Design Guide for DSP and Arm Application Processors (Rev. B) 2017/08/14
User guide Phase-Locked Loop (PLL) for KeyStone Devices User's Guide (Rev. I) 2017/07/26
User guide ARM Assembly Language Tools v17.6.0.STS User's Guide (Rev. S) 2017/06/21
User guide ARM Optimizing C/C++ Compiler v17.6.0.STS User's Guide (Rev. P) 2017/06/21
Application note PCI Express (PCIe) Resource Wiki for Keystone Devices (Rev. A) 2017/05/19
User guide Serializer/Deserializer (SerDes) for KeyStone II Devices User Guide (Rev. A) 2016/07/27
Application note Power Management of KS2 Device (Rev. C) 2016/07/15
User guide ARM Assembly Language Tools v16.9.0.LTS User's Guide (Rev. P) 2016/04/30
User guide ARM Optimizing C/C++ Compiler v16.9.0.LTS User's Guide (Rev. M) 2016/04/30
Application note SERDES Link Commissioning on KeyStone I and II Devices 2016/04/13
White paper Multicore SoCs stay a step ahead of SoC FPGAs 2016/02/23
Application note TI DSP Benchmarking 2016/01/13
Application note Throughput Performance Guide for KeyStone II Devices (Rev. B) 2015/12/22
Application note Keystone II DDR3 Debug Guide 2015/10/16
User guide Enhanced Direct memory Access 3 (EDMA3) for KeyStone Devices User's Guide (Rev. B) 2015/05/06
User guide Multicore Navigator (CPPI) for KeyStone Architecture User's Guide (Rev. H) PDF | HTML 2015/04/09
User guide DDR3 Memory Controller for KeyStone II Devices User's Guide (Rev. C) 2015/03/27
White paper TI’s processors leading the way in embedded analytics 2015/03/03
Application note Keystone II DDR3 Initialization 2015/01/26
User guide ARM Assembly Language Tools v5.2 User's Guide (Rev. M) 2014/11/05
User guide ARM Optimizing C/C++ Compiler v5.2 User's Guide (Rev. J) 2014/11/05
User guide Power Sleep Controller (PSC) for KeyStone Devices User's Guide (Rev. C) 2014/09/04
User guide Serial RapidIO (SRIO) for KeyStone Devices User's Guide (Rev. C) 2014/09/03
White paper KeyStone™-II-based processors: 10G Ethernet as an optical interface 2014/08/25
Application note Hardware Design Guide for KeyStone II Devices 2014/03/24
Product overview The Case for 10G Ethernet in Embedded Processing 2013/11/13
Product overview 66AK2Hx KeyStone Multicore DSP+ARM System-on-chips (Rev. A) 2013/11/08
User guide PCI Express (PCIe) for KeyStone Devices User's Guide (Rev. D) 2013/09/30
User guide Debug and Trace for KeyStone II Devices User's Guide 2013/07/26
User guide ARM Bootloader User Guide for KeyStone II Devices 2013/07/21
User guide DSP Bootloader for KeyStone Architecture User's Guide (Rev. C) 2013/07/15
User guide Gigabit Ethernet Switch Subsystem for KeyStone Devices User's Guide (Rev. D) 2013/07/03
User guide C66x CorePac User's Guide (Rev. C) 2013/06/28
User guide Memory Protection Unit (MPU) for KeyStone Devices User's Guide (Rev. A) 2013/06/28
User guide HyperLink for KeyStone Devices User's Guide (Rev. C) 2013/05/28
User guide 10 Gigabit Ethernet Switch Subsystem User Guide for KeyStone II Devices 2013/02/08
User guide Security Accelerator (SA) for KeyStone Devices User's Guide (Rev. B) 2013/02/05
Product overview Multicore DSPs for High-Performance Video Coding 2013/01/22
User guide Multicore Shared Memory Controller (MSMC) User Guide for KeyStone II Devices 2012/11/12
Product overview Industrial Imaging: Applications of the K2H and K2E platforms 2012/11/09
Product overview Video Infrastructure - Applications of the K2E, K2H platforms 2012/11/09
User guide ARM CorePac User Guide for KeyStone II Devices 2012/10/31
Application note Multicore Programming Guide (Rev. B) 2012/08/29
User guide Packet Accelerator (PA) for KeyStone Devices User's Guide (Rev. A) 2012/07/11
User guide Serial Peripheral Interface (SPI) for KeyStone Devices User’s Guide (Rev. A) 2012/03/30
User guide Chip Interrupt Controller (CIC) for KeyStone Devices User's Guide (Rev. A) 2012/03/27
User guide 64-Bit Timer (Timer64) for KeyStone Devices User's Guide (Rev. A) 2012/03/22
Application note PCIe Use Cases for KeyStone Devices 2011/12/13
Application note Introduction to TMS320C6000 DSP Optimization 2011/10/06
User guide Inter-Integrated Circuit (I2C) for KeyStone Devices User's Guide 2011/09/02
User guide External Memory Interface (EMIF16) for KeyStone Devices User's Guide (Rev. A) 2011/05/24
White paper Software and Hardware Design Challenges Due to Dynamic Raw NAND Market 2011/05/19
User guide C66x CPU and Instruction Set Reference Guide 2010/11/09
User guide C66x DSP Cache User's Guide 2010/11/09
Application note Clocking Design Guide for KeyStone Devices 2010/11/09
User guide General-Purpose Input/Output (GPIO) forKeyStone Devices User's Guide 2010/11/09
Application note Optimizing Loops on the C66x DSP 2010/11/09
User guide Universal Asynchronous Receiver/Transmitter (UART) for KeyStone Devices UG 2010/11/09
User guide Network Coprocessor for KeyStone Devices User's Guide 2010/11/02

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디버그 프로브

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XDS200은 TI 임베디드 디바이스 디버깅에 사용되는 디버그 프로브(에뮬레이터)입니다. XDS200은 저렴한 XDS110 및 고성능 XDS560v2에 비해 저렴한 비용으로 우수한 성능을 균형 있게 제공합니다. 단일 포드에서 광범위한 표준(IEEE1149.1, IEEE1149.7, SWD)을 지원합니다. 모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 Arm® 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 코어 추적의 경우 XDS560v2 PRO TRACE가 (...)

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모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 ARM 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

XDS560v2는 MIPI HSPT 60핀 커넥터(TI 14핀, (...)

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TMDSEMU560V2STM-UE — XDS560v2 시스템 추적 USB 및 이더넷 디버그 프로브

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All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

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소프트웨어 개발 키트(SDK)

BIOSLINUXMCSDK-K2 — MCSDK supporting SYS/BIOS RTOS and Linux OS for KeyStone II ARM A15 + DSP C66x

NOTE: K2x, C665x and C667x devices are now actively maintained on the Processor-SDK release stream. See links above.

Our Multicore Software Development Kits (MCSDK) provide highly-optimized bundles of foundational, platform-specific drivers to enable development on selected TI ARM and DSP devices. (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
66AK2E05 — 고성능 멀티 코어 DSP+Arm - 4x Arm A15 코어, 1x C66x DSP 코어, NetCP, 10GbE 66AK2H06 — 고성능 멀티 코어 DSP+Arm - 2x Arm A15 코어, 4x C66x DSP 코어 66AK2H12 — 고성능 멀티 코어 DSP+Arm - Arm A15 코어 4개, C66x DSP 코어 8개 66AK2H14 — 고성능 멀티코어 DSP+Arm - 4x Arm A15 코어, 8x C66x DSP 코어, 10GbE AM5K2E02 — Sitara™ 프로세서: 듀얼 Arm Cortex-A15 AM5K2E04 — Sitara 프로세서: 쿼드 Arm Cortex-A15
DSP(디지털 신호 프로세서)
66AK2L06 — 멀티코어 DSP+ARM KeyStone II 시스템온칩(SoC)
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지원되는 제품 및 하드웨어

제품
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66AK2H06 — 고성능 멀티 코어 DSP+Arm - 2x Arm A15 코어, 4x C66x DSP 코어 66AK2H12 — 고성능 멀티 코어 DSP+Arm - Arm A15 코어 4개, C66x DSP 코어 8개 66AK2H14 — 고성능 멀티코어 DSP+Arm - 4x Arm A15 코어, 8x C66x DSP 코어, 10GbE
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지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
66AK2H06 — 고성능 멀티 코어 DSP+Arm - 2x Arm A15 코어, 4x C66x DSP 코어 66AK2H12 — 고성능 멀티 코어 DSP+Arm - Arm A15 코어 4개, C66x DSP 코어 8개 66AK2H14 — 고성능 멀티코어 DSP+Arm - 4x Arm A15 코어, 8x C66x DSP 코어, 10GbE
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지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
66AK2H06 — 고성능 멀티 코어 DSP+Arm - 2x Arm A15 코어, 4x C66x DSP 코어 66AK2H12 — 고성능 멀티 코어 DSP+Arm - Arm A15 코어 4개, C66x DSP 코어 8개 66AK2H14 — 고성능 멀티코어 DSP+Arm - 4x Arm A15 코어, 8x C66x DSP 코어, 10GbE
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드라이버 또는 라이브러리

SPRC264 — TMS320C5000/6000 이미지 라이브러리(IMGLIB)

C5000/6000 Image Processing Library (IMGLIB) is an optimized image/video processing function library for C programmers. It includes C-callable general-purpose image/video processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
사용 설명서: PDF
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드라이버 또는 라이브러리

SPRC265 — TMS320C6000 DSP 라이브러리(DSPLIB)

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
사용 설명서: PDF
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IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

이 설계 리소스는 이러한 범주의 제품 대부분을 지원합니다.

제품 세부 정보 페이지에서 지원을 확인하십시오.
시작 다운로드 옵션
소프트웨어 코덱

C66XCODECS — 코덱 - 비디오, 음성 - C66x 기반 디바이스

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into video and voice applications. In many cases, the C64x+ codecs are provided and validated for C66x platforms. Datasheets and Release Notes are on the download (...)
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시뮬레이션 모델

66AK2H14 AAW BSDL Model

SPRM608.ZIP (36 KB) - BSDL Model
다운로드
시뮬레이션 모델

66AK2H14 AAW IBIS Model

SPRM619.ZIP (2189 KB) - IBIS Model
다운로드
시뮬레이션 모델

66AK2H14 Power Consumption Model (Rev. A)

SPRM651A.ZIP (135 KB) - Power Model
다운로드
시뮬레이션 모델

66AK2Hx FloTherm Model

SPRM603.ZIP (6 KB) - Power Model
다운로드
시뮬레이션 모델

KeyStone II IBIS AMI Models

SPRM743.ZIP (265889 KB) - IBIS-AMI Model
lock = 수출 승인 필요(1분)
lock 다운로드
회로도

66AK2H14 66AK2H12 66AK2H106 AAW OrCAD Symbols

SPRR189.ZIP (144 KB)
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레퍼런스 디자인

TIDEP0045 — TI의 C6678 DSP에서 실시간 SAR(합성 개구면 레이더) 구현 레퍼런스 디자인

This reference design shows a real-time synthetic aperture radar (SAR) running on a multicore TMS320C6678 digital signal processor (DSP). One of the main challenges of  SAR is to generate high-resolution images in real-time, since forming the image involves computationally-demanding signal (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

TIDEP0037 — TMS320C6678 프로세서를 사용하여 전력 효율 확장 가능한 H.265/HEVC 솔루션 구현 레퍼런스 디자인

HEVC is an efficient, but processing intensive video standard, that is said to double the data compression ratio compared to H.264 / MPEG-4 at the same level of video quality. This design shows how a power efficient, soft H.265 / HEVC solution, that scales across resolutions, frame rates & (...)
Design guide: PDF
회로도: PDF
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
FCBGA (AAW) 1517 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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