제품 상세 정보

Rating Catalog Integrated isolated power No Isolation rating Reinforced Number of channels 4 Forward/reverse channels 2 forward / 2 reverse Default output High, Low Data rate (max) (Mbps) 100 Surge isolation voltage (VIOSM) (VPK) 12800 Transient isolation voltage (VIOTM) (VPK) 8000 Withstand isolation voltage (VISO) (Vrms) 5700 CMTI (min) (V/µs) 85000 Operating temperature range (°C) -55 to 125 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.25 Propagation delay time (typ) (µs) 0.0107 Current consumption per channel (DC) (typ) (mA) 1 Current consumption per channel (1 Mbps) (typ) (mA) 1.65 Creepage (min) (mm) 8, 14.5 Clearance (min) (mm) 8, 14.5
Rating Catalog Integrated isolated power No Isolation rating Reinforced Number of channels 4 Forward/reverse channels 2 forward / 2 reverse Default output High, Low Data rate (max) (Mbps) 100 Surge isolation voltage (VIOSM) (VPK) 12800 Transient isolation voltage (VIOTM) (VPK) 8000 Withstand isolation voltage (VISO) (Vrms) 5700 CMTI (min) (V/µs) 85000 Operating temperature range (°C) -55 to 125 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.25 Propagation delay time (typ) (µs) 0.0107 Current consumption per channel (DC) (typ) (mA) 1 Current consumption per channel (1 Mbps) (typ) (mA) 1.65 Creepage (min) (mm) 8, 14.5 Clearance (min) (mm) 8, 14.5
SOIC (DW) 16 106.09 mm² 10.3 x 10.3 SOIC (DWW) 16 177.675 mm² 10.3 x 17.25
  • Signaling Rate: Up to 100Mbps
  • Wide Supply Range: 2.25V to 5.5V
  • 2.25V to 5.5V Level Translation
  • Wide Temperature Range: –55°C to +125°C
  • Low-Power Consumption, Typical 1.7mA per Channel at 1Mbps
  • Low Propagation Delay: 11ns Typical (5V Supplies)
  • Industry leading CMTI (Min): ±100kV/µs
  • Robust Electromagnetic Compatibility (EMC)
  • System-Level ESD, EFT, and Surge Immunity
  • Low Emissions
  • Isolation Barrier Life: >40 Years
  • Wide Body SOIC-16 Package and Extra-Wide Body SOIC-16 Package Options
  • Safety and Regulatory Approvals:
    • 8000VPK Reinforced Isolation per DIN EN IEC 60747-17 (VDE 0884-17)
    • 5.7kVRMS Isolation for 1 Minute per UL 1577
    • CSA Component Acceptance Notice 5A, IEC 60950-1 and IEC 60601-1 End Equipment Standards
    • CQC Certification per GB4943.1
    • TUV Certification per EN 61010-1 and EN 62368-1
  • Signaling Rate: Up to 100Mbps
  • Wide Supply Range: 2.25V to 5.5V
  • 2.25V to 5.5V Level Translation
  • Wide Temperature Range: –55°C to +125°C
  • Low-Power Consumption, Typical 1.7mA per Channel at 1Mbps
  • Low Propagation Delay: 11ns Typical (5V Supplies)
  • Industry leading CMTI (Min): ±100kV/µs
  • Robust Electromagnetic Compatibility (EMC)
  • System-Level ESD, EFT, and Surge Immunity
  • Low Emissions
  • Isolation Barrier Life: >40 Years
  • Wide Body SOIC-16 Package and Extra-Wide Body SOIC-16 Package Options
  • Safety and Regulatory Approvals:
    • 8000VPK Reinforced Isolation per DIN EN IEC 60747-17 (VDE 0884-17)
    • 5.7kVRMS Isolation for 1 Minute per UL 1577
    • CSA Component Acceptance Notice 5A, IEC 60950-1 and IEC 60601-1 End Equipment Standards
    • CQC Certification per GB4943.1
    • TUV Certification per EN 61010-1 and EN 62368-1

The ISO7842x device is a high-performance, quad-channel digital isolator with a 8000VPK isolation voltage. This device has reinforced isolation certifications according to VDE, CSA, CQC, and TUV. The isolator provides high electromagnetic immunity and low emissions at low-power consumption while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by a silicon-dioxide (SiO2) insulation barrier.

This device comes with enable pins that can be used to put the respective outputs in high impedance for multi-master driving applications and to reduce power consumption. The ISO7842 device has two forward and two reverse-direction channels. If the input power or signal is lost, the default output is high for the ISO7842 device and low for the ISO7842F device. See the Device Functional Modes section for further details.

Used in conjunction with isolated power supplies, this device helps prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. Through innovative chip design and layout techniques, electromagnetic compatibility of the ISO7842 device has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance.

The ISO7842 device is available in 16-pin SOIC wide-body (DW) and extra-wide body (DWW) packages.

The ISO7842x device is a high-performance, quad-channel digital isolator with a 8000VPK isolation voltage. This device has reinforced isolation certifications according to VDE, CSA, CQC, and TUV. The isolator provides high electromagnetic immunity and low emissions at low-power consumption while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by a silicon-dioxide (SiO2) insulation barrier.

This device comes with enable pins that can be used to put the respective outputs in high impedance for multi-master driving applications and to reduce power consumption. The ISO7842 device has two forward and two reverse-direction channels. If the input power or signal is lost, the default output is high for the ISO7842 device and low for the ISO7842F device. See the Device Functional Modes section for further details.

Used in conjunction with isolated power supplies, this device helps prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. Through innovative chip design and layout techniques, electromagnetic compatibility of the ISO7842 device has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance.

The ISO7842 device is available in 16-pin SOIC wide-body (DW) and extra-wide body (DWW) packages.

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기술 자료

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23개 모두 보기
유형 직함 날짜
* Data sheet ISO7842x High-Performance, 8000VPK Reinforced Quad-Channel Digital Isolator datasheet (Rev. H) PDF | HTML 2024/03/05
Certificate VDE Certificate for Reinforced Isolation for DIN EN IEC 60747-17 (Rev. S) 2024/02/29
Application note Digital Isolator Design Guide (Rev. G) PDF | HTML 2023/09/13
White paper Improve Your System Performance by Replacing Optocouplers with Digital Isolators (Rev. C) PDF | HTML 2023/09/07
White paper Circuit Board Insulation Design According to IEC60664 for Motor Drive Apps PDF | HTML 2023/08/31
Certificate CQC Certificate for ISOxxDWx (Rev. J) 2023/03/27
Certificate CSA Certificate for ISO78xxDWx 2023/03/13
Certificate TUV Certificate for Isolation Devices (Rev. K) 2022/08/05
Certificate UL Certificate of Compliance File E181974 Vol 4 Sec 6 (Rev. P) 2022/08/05
White paper Why are Digital Isolators Certified to Meet Electrical Equipment Standards? 2021/11/16
White paper Distance Through Insulation: How Digital Isolators Meet Certification Requiremen PDF | HTML 2021/06/11
EVM User's guide Universal Digital Isolator Evaluation Module PDF | HTML 2021/03/04
Functional safety information Isolation in AC Motor Drives: Understanding the IEC 61800-5-1 Safety Standard (Rev. A) 2019/09/19
Analog Design Journal Pushing the envelope with high-performance digital-isolation technology (Rev. A) 2018/08/22
Application brief Considerations for Selecting Digital Isolators 2018/07/24
Functional safety information Isolation in solar power converters: Understanding the IEC62109-1 safety standar (Rev. A) 2018/05/18
Analog Design Journal How to reduce radiated emissions of digital isolators for systems with RF module 2018/03/26
Application note Isolation Glossary (Rev. A) 2017/09/19
Analog Design Journal 4Q 2015 Analog Applications Journal 2015/10/30
Analog Design Journal Pushing the envelope with high-performance digital-isolation technology 2015/10/30
EVM User's guide ISO784xx Quad-Channel Digital Isolator EVM User Guide 2014/10/17
White paper Understanding electromagnetic compliance tests in digital isolators 2014/10/17
White paper High-voltage reinforced isolation: Definitions and test methodologies 2014/10/16

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

DIGI-ISO-EVM — 범용 디지털 아이솔레이터 평가 모듈

DIGI-ISO-EVM은 5가지 패키지(8핀 네로우 바디 SOIC(D), 8핀 와이드 바디 SOIC(DWV), 16핀 와이드 바디 SOIC(DW), 16핀 울트라 와이드 바디 SOIC(DWW), 16핀 QSOP(DBQ) 패키지)에서 TI 싱글 채널, 듀얼 채널, 트리플 채널, 쿼드 채널 또는 6채널 디지털 절연기 장치를 평가하는 데 사용되는 평가 모듈(EVM)입니다. EVM에는 최소한의 외부 구성품으로 장치를 평가할 수 있는 충분한 Berg 핀 옵션이 있습니다.

사용 설명서: PDF | HTML
TI.com에서 구매 불가
평가 보드

ISO7842-EVM — 높은 내성, 5.7kVRMS의 강화 쿼드-채널 2/2 디지털 아이솔레이터, 평가 모듈

The ISO7842 provides galvanic isolation up to 5700 VRMS for 1 minute per UL and 8000 VPK per VDE. This device has four isolated channels comprised of a logic input and output buffer separated by a silicon dioxide (SiO2) insulation barrier. Used in conjunction with isolated power supplies, this (...)

사용 설명서: PDF
TI.com에서 구매 불가
시뮬레이션 모델

ISO7842 IBIS Model (Rev. A)

SLLM263A.ZIP (52 KB) - IBIS Model
시뮬레이션 모델

ISO7842F IBIS Model (Rev. A)

SLLM278A.ZIP (52 KB) - IBIS Model
레퍼런스 디자인

TIDA-00420 — ADC 기반, 디지털 절연, 넓은 입력, 16채널, AC/DC 이진 입력 레퍼런스 설계

This reference design showcases a cost-optimized and scalable ADC-based AC/DC binary input module (BIM) architecture with reinforced isolation. The 16 channels of a 10- or 12-bit SAR ADC are used for sensing multiple binary inputs. The op amps, in addition to keeping the cost per-channel low, (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

TIDA-00267 — 극성 보정 절연 CAN 레퍼런스 디자인

A ready to use design that efficiently solves the problem of improper installation by adding antiparallel communication channels and appropriate control signal to enable polarity correction for the Controller Area Network (CAN) bus.
회로도: PDF
레퍼런스 디자인

TIDA-01037 — SNR 및 샘플 레이트를 극대화하는 20비트, 1MSPS 아이솔레이터 최적화 데이터 수집 레퍼런스 디자인

TIDA-01037 is a 20-bit, 1 MSPS isolated analog input data acquisition reference design that utilizes two different isolator devices to maximize signal chain SNR and sample rate performance. For signals requiring low jitter, such as ADC sampling clocks, TI’s ISO73xx family of low jitter (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

TIDA-01590 — 태양광 접속함용 1200V 절연 I2C 고압측 전류 감지를 위한 레퍼런스 설계

This reference design is an isolated high-side current sensing design for a smart combiner box in a grounded or ungrounded system. The current sensing topology enables multichannel, sub ±1% error, isolated current sensing for high-voltage systems up to 1200-VDC, limited by the DC/DC (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

TIDA-01035 — 최대 SNR 및 샘플 레이트용 지터를 최적화하는 20qlxm 절연 데이터 수집 레퍼런스 디자인

The TIDA-01035 is a 20-bit, 1 MSPS isolated analog input data acquisition reference design demonstrating how to resolve and optimize performance challenges typical of digitally isolated data acquisition systems.
  • Significantly improves high frequency AC signal chain performance (SNR  and THD) by (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

TIDA-00732 — 최대 SNR 및 샘플링 속도 달성을 위한 18비트, 2Msps 절연 데이터 수집 레퍼런스 디자인

This “18-bit, 2-Msps Isolated Data Acquisition Reference Design to achieve maximum SNR and sampling rate”  illustrates how to overcome performance-limiting challenges typical of isolated data acquisition system design:
  • Maximizing sampling rate by minimizing propagation delay introduced by digital (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

TIDA-00448 — 강화 디지털 아이솔레이터를 지원하는 유연한 고전류 IGBT 게이트 드라이버 레퍼런스 디자인

The TIDA-00448 reference design is an isolated IGBT gate driver with bipolar gate voltages intended for driving  high power IGBT’s requiring high peak gate current up to 40 A. TI’s NexFET power blocks which scales in this range, with same package, enables single design to be used (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

TIDA-00330 — 강화 절연 M-LVDS 트랜시버 레퍼런스 설계

This reference design demonstrates the performance of a reinforced, isolated, full-duplex M-LVDS transceiver node using the ISO7842 and SN65MLVD203. A single reinforced digital isolator replaces two basic digital isolators, reducing cost and PCB area.
Design guide: PDF
회로도: PDF
패키지 CAD 기호, 풋프린트 및 3D 모델
SOIC (DW) 16 Ultra Librarian
SOIC (DWW) 16 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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