TMS570LS3137-EP

활성

향상된 제품 16/32비트 RISC 플래시 Arm Cortex-R4F, EMAC, FlexRay

제품 상세 정보

Frequency (MHz) 180 Flash memory (kByte) 3072 RAM (kByte) 256 ADC type 2 x 12-bit (24ch) Number of GPIOs 144 UART 2 Features Hercules high-performance microcontroller Operating temperature range (°C) -55 to 125 Ethernet Yes PWM (Ch) 44 SPI 2 CAN (#) 3 Power supply solution TPS65381A-Q1 Communication interface CAN, Ethernet, FlexRay, SPI, UART
Frequency (MHz) 180 Flash memory (kByte) 3072 RAM (kByte) 256 ADC type 2 x 12-bit (24ch) Number of GPIOs 144 UART 2 Features Hercules high-performance microcontroller Operating temperature range (°C) -55 to 125 Ethernet Yes PWM (Ch) 44 SPI 2 CAN (#) 3 Power supply solution TPS65381A-Q1 Communication interface CAN, Ethernet, FlexRay, SPI, UART
NFBGA (GWT) 337 256 mm² 16 x 16
  • High-Performance Microcontroller for Safety-
    Critical Applications
    • Dual CPUs Running in Lockstep
    • ECC on Flash and RAM interfaces
    • Built-In Self-Test for CPU and On-chip RAMs
    • Error Signaling Module with Error Pin
    • Voltage and Clock Monitoring
  • ARM® Cortex – R4F 32-Bit RISC CPU
    • Efficient 1.66 DMIPS/MHz with 8-Stage Pipeline
    • FPU with Single- and Double-Precision
    • 12-Region Memory Protection Unit
    • Open Architecture with Third-Party Support
  • Operating Conditions
    • Up to 180-MHz System Clock
    • Core Supply Voltage (VCC): 1.2 V Nominal
    • I/O Supply Voltage (VCCIO): 3.3 V Nominal
    • ADC Supply Voltage (VCCAD): 3.0 to 5.25 V
    • IP Modules GBD for –40°C to 125°C Only
      includes Flash, MibADC timings, nPORRST,
      N2HET, and FlexRay
  • Integrated Memory
    • 3MB of Program Flash With ECC
    • 256KB of RAM With ECC
    • 64KB of Flash With ECC for Emulated
      EEPROM
  • 16-Bit External Memory Interface
  • Common Platform Architecture
    • Consistent Memory Map Across Family
    • Real-Time Interrupt Timer (RTI) OS Timer
    • 96-Channel Vectored Interrupt Module (VIM)
    • 2-Channel Cyclic Redundancy Checker (CRC)
  • Direct Memory Access (DMA) Controller
    • 16 Channels and 32 Control Packets
    • Parity Protection for Control Packet RAM
    • DMA Accesses Protected by Dedicated MPU
  • Frequency-Modulated Phase-Locked-Loop
    (FMPLL) with Built-In Slip Detector
  • Separate Nonmodulating PLL
  • IEEE 1149.1 JTAG, Boundary Scan and ARM
    CoreSight™ Components
  • JTAG Security Module
  • Trace and Calibration Capabilities
    • Embedded Trace Macrocell (ETM-R4)
    • Data Modification Module (DMM)
    • RAM Trace Port (RTP)
    • Parameter Overlay Module (POM)
  • Multiple Communication Interfaces
    • 10/100 Mbps Ethernet MAC (EMAC)
      • IEEE 802.3 Compliant (3.3-V I/O only)
      • Supports MII, RMII and MDIO
    • FlexRay Controller with Two Channels
      • 8 KB message RAM with Parity Protection
      • Dedicated Transfer Unit (FTU)
    • Three CAN Controllers (DCANs)
      • 64 Mailboxes, Each with Parity Protection
      • Compliant to CAN Protocol Version 2.0B
    • Local Interconnect Network (LIN) Interface
      Controller
      • Compliant to LIN Protocol Version 2.1
      • Can be Configured as a Second SCI
    • Standard Serial Communication Interface (SCI)
    • Inter-Integrated Circuit (I2C)
    • Three Multibuffered Serial Peripheral Interfaces
      (MibSPIs)
      • 128 Words with Parity Protection Each
    • Two Standard Serial Peripheral Interfaces
      (SPIs)
  • Two High-End Timer Modules (N2HETs)
    • N2HET1: 32 Programmable Channels
    • N2HET2: 18 Programmable Channels
    • 160-Word Instruction RAM with Parity Protection
      Each
    • Each N2HET Includes Hardware Angle
      Generator
    • Dedicated Transfer Unit with MPU for Each
      N2HET (HTU)
  • Two 10- or 12-bit Multibuffered ADC Modules
    • ADC1: 24 Channels
    • ADC2: 16 Channels Shared with ADC1
    • 64 Result Buffers with Parity Protection Each
  • Sixteen General-Purpose Input/Output Pins (GPIO)
    Capable of Generating Interrupts
  • Package
    • 337-Ball Grid Array (SnPb) (GWT)
  • High-Performance Microcontroller for Safety-
    Critical Applications
    • Dual CPUs Running in Lockstep
    • ECC on Flash and RAM interfaces
    • Built-In Self-Test for CPU and On-chip RAMs
    • Error Signaling Module with Error Pin
    • Voltage and Clock Monitoring
  • ARM® Cortex – R4F 32-Bit RISC CPU
    • Efficient 1.66 DMIPS/MHz with 8-Stage Pipeline
    • FPU with Single- and Double-Precision
    • 12-Region Memory Protection Unit
    • Open Architecture with Third-Party Support
  • Operating Conditions
    • Up to 180-MHz System Clock
    • Core Supply Voltage (VCC): 1.2 V Nominal
    • I/O Supply Voltage (VCCIO): 3.3 V Nominal
    • ADC Supply Voltage (VCCAD): 3.0 to 5.25 V
    • IP Modules GBD for –40°C to 125°C Only
      includes Flash, MibADC timings, nPORRST,
      N2HET, and FlexRay
  • Integrated Memory
    • 3MB of Program Flash With ECC
    • 256KB of RAM With ECC
    • 64KB of Flash With ECC for Emulated
      EEPROM
  • 16-Bit External Memory Interface
  • Common Platform Architecture
    • Consistent Memory Map Across Family
    • Real-Time Interrupt Timer (RTI) OS Timer
    • 96-Channel Vectored Interrupt Module (VIM)
    • 2-Channel Cyclic Redundancy Checker (CRC)
  • Direct Memory Access (DMA) Controller
    • 16 Channels and 32 Control Packets
    • Parity Protection for Control Packet RAM
    • DMA Accesses Protected by Dedicated MPU
  • Frequency-Modulated Phase-Locked-Loop
    (FMPLL) with Built-In Slip Detector
  • Separate Nonmodulating PLL
  • IEEE 1149.1 JTAG, Boundary Scan and ARM
    CoreSight™ Components
  • JTAG Security Module
  • Trace and Calibration Capabilities
    • Embedded Trace Macrocell (ETM-R4)
    • Data Modification Module (DMM)
    • RAM Trace Port (RTP)
    • Parameter Overlay Module (POM)
  • Multiple Communication Interfaces
    • 10/100 Mbps Ethernet MAC (EMAC)
      • IEEE 802.3 Compliant (3.3-V I/O only)
      • Supports MII, RMII and MDIO
    • FlexRay Controller with Two Channels
      • 8 KB message RAM with Parity Protection
      • Dedicated Transfer Unit (FTU)
    • Three CAN Controllers (DCANs)
      • 64 Mailboxes, Each with Parity Protection
      • Compliant to CAN Protocol Version 2.0B
    • Local Interconnect Network (LIN) Interface
      Controller
      • Compliant to LIN Protocol Version 2.1
      • Can be Configured as a Second SCI
    • Standard Serial Communication Interface (SCI)
    • Inter-Integrated Circuit (I2C)
    • Three Multibuffered Serial Peripheral Interfaces
      (MibSPIs)
      • 128 Words with Parity Protection Each
    • Two Standard Serial Peripheral Interfaces
      (SPIs)
  • Two High-End Timer Modules (N2HETs)
    • N2HET1: 32 Programmable Channels
    • N2HET2: 18 Programmable Channels
    • 160-Word Instruction RAM with Parity Protection
      Each
    • Each N2HET Includes Hardware Angle
      Generator
    • Dedicated Transfer Unit with MPU for Each
      N2HET (HTU)
  • Two 10- or 12-bit Multibuffered ADC Modules
    • ADC1: 24 Channels
    • ADC2: 16 Channels Shared with ADC1
    • 64 Result Buffers with Parity Protection Each
  • Sixteen General-Purpose Input/Output Pins (GPIO)
    Capable of Generating Interrupts
  • Package
    • 337-Ball Grid Array (SnPb) (GWT)

The TMS570LS3137-EP device is a high-performance microcontroller family for safety systems. The safety architecture includes the following:

  • Dual CPUs in lockstep
  • CPU and memory built-in self-test (BIST) logic
  • ECC on both the flash and the data SRAM
  • Parity on peripheral memories
  • Loopback capability on peripheral I/Os

The TMS570LS3137-EP device integrates the ARM Cortex-R4F Floating-Point CPU which offers an efficient 1.66 DMIPS/MHz, and has configurations which can run up to 180 MHz, providing up to 298 DMIPS. The device supports the word-invariant big-endian [BE32] format.

The TMS570LS3137-EP device has 3MB of integrated flash and 256KB of data RAM with single-bit error correction and double-bit error detection. The flash memory on this device is a nonvolatile, electrically erasable and programmable memory implemented with a 64-bit-wide data bus interface. The flash operates on a 3.3-V supply input (same level as I/O supply) for all read, program and erase operations. When in pipeline mode, the flash operates with a system clock frequency of up to 180 MHz. The SRAM supports single-cycle read and write accesses in byte, halfword, word and double-word modes.

The TMS570LS3137-EP device features peripherals for real-time control-based applications, including two Next Generation High-End Timer (N2HET) timing coprocessors and two 12-bit analog-to-digital converters (ADCs) supporting up to 24 inputs.

The N2HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software-controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The N2HET can be used for pulse-width-modulated outputs, capture or compare inputs, or GPIO. The N2HET is especially well suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. A High-End Timer Transfer Unit (HTU) can perform DMA-type transactions to transfer N2HET data to or from main memory. A Memory Protection Unit (MPU) is built into the HTU.

The device has two 12-bit-resolution MibADCs with 24 channels and 64 words of parity-protected buffer RAM each. The MibADC channels can be converted individually or can be grouped by software for sequential conversion sequences. Sixteen channels are shared between the two MibADCs. There are three separate groupings. Each sequence can be converted once when triggered or configured for continuous conversion mode.

The device has multiple communication interfaces: three MibSPIs, , one LIN, one SCI, three DCANs, one I2C. The SPIs provide a convenient method of serial high-speed communication between similar shift-register type devices. The LIN supports the Local Interconnect standard 2.0 and can be used as a UART in full-duplex mode using the standard Non-Return-to-Zero (NRZ) format.

The DCAN supports the CAN 2.0 (A and B) protocol standard and uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 Mbps. The DCAN is ideal for systems operating in noisy and harsh environments (for example, automotive vehicle networking and industrial fieldbus) that require reliable serial communication or multiplexed wiring.

The I2C module is a multimaster communication module providing an interface between the microcontroller and an I2C-compatible device via the I2C serial bus. The I2C supports speeds of 100 and 400 Kbps.

The frequency-modulated phase-locked loop (FMPLL) clock module is used to multiply the external frequency reference to a higher frequency for internal use. There are two FMPLL modules on this device. These modules, when enabled, provide two of the seven possible clock source inputs to the global clock module (GCM). The GCM manages the mapping between the available clock sources and the device clock domains.

The device also has an external clock prescaler (ECP) module that when enabled, outputs a continuous external clock on the ECLK pin/ball. The ECLK frequency is a user-programmable ratio of the peripheral interface clock (VCLK) frequency. This low-frequency output can be monitored externally as an indicator of the device operating frequency.

The DMA controller has 16 channels, 32 control packets and parity protection on its memory. An MPU is built into the DMA to limit the DMA to prescribed areas of memory and to protect the rest of the memory system from any malfunction of the DMA.

The Error Signaling Module (ESM) monitors all device errors and determines whether an interrupt is generated or the external ERROR pin is toggled when a fault is detected. The ERROR pin can be monitored externally as an indicator of a fault condition in the microcontroller.

The External Memory Interface (EMIF) provides off-chip expansion capability with the ability to interface to synchronous DRAM (SDRAM) devices, asynchronous memories, peripherals or FPGA devices.

Several interfaces are implemented to enhance the debugging capabilities of application code. In addition to the built in ARM Cortex-R4F CoreSight debug features an External Trace Macrocell (ETM) provides instruction and data trace of program execution. For instrumentation purposes, a RAM Trace Port (RTP) module is implemented to support high-speed tracing of RAM and peripheral accesses by the CPU or any other master. A Data Modification Module (DMM) gives the ability to write external data into the device memory. Both the RTP and DMM have no or only minimum impact on the program execution time of the application code. A Parameter Overlay Module (POM) can reroute flash accesses to internal memory or to the EMIF. This rerouting allows parameters and tables to be dynamically calibrated against production code without rebuilding the code to explicitly access RAM or halting the processor to reprogram the data flash.

With integrated safety features and a wide choice of communication and control peripherals, the device is an ideal solution for high-performance real-time control applications with safety-critical requirements.

The TMS570LS3137-EP device is a high-performance microcontroller family for safety systems. The safety architecture includes the following:

  • Dual CPUs in lockstep
  • CPU and memory built-in self-test (BIST) logic
  • ECC on both the flash and the data SRAM
  • Parity on peripheral memories
  • Loopback capability on peripheral I/Os

The TMS570LS3137-EP device integrates the ARM Cortex-R4F Floating-Point CPU which offers an efficient 1.66 DMIPS/MHz, and has configurations which can run up to 180 MHz, providing up to 298 DMIPS. The device supports the word-invariant big-endian [BE32] format.

The TMS570LS3137-EP device has 3MB of integrated flash and 256KB of data RAM with single-bit error correction and double-bit error detection. The flash memory on this device is a nonvolatile, electrically erasable and programmable memory implemented with a 64-bit-wide data bus interface. The flash operates on a 3.3-V supply input (same level as I/O supply) for all read, program and erase operations. When in pipeline mode, the flash operates with a system clock frequency of up to 180 MHz. The SRAM supports single-cycle read and write accesses in byte, halfword, word and double-word modes.

The TMS570LS3137-EP device features peripherals for real-time control-based applications, including two Next Generation High-End Timer (N2HET) timing coprocessors and two 12-bit analog-to-digital converters (ADCs) supporting up to 24 inputs.

The N2HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software-controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The N2HET can be used for pulse-width-modulated outputs, capture or compare inputs, or GPIO. The N2HET is especially well suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. A High-End Timer Transfer Unit (HTU) can perform DMA-type transactions to transfer N2HET data to or from main memory. A Memory Protection Unit (MPU) is built into the HTU.

The device has two 12-bit-resolution MibADCs with 24 channels and 64 words of parity-protected buffer RAM each. The MibADC channels can be converted individually or can be grouped by software for sequential conversion sequences. Sixteen channels are shared between the two MibADCs. There are three separate groupings. Each sequence can be converted once when triggered or configured for continuous conversion mode.

The device has multiple communication interfaces: three MibSPIs, , one LIN, one SCI, three DCANs, one I2C. The SPIs provide a convenient method of serial high-speed communication between similar shift-register type devices. The LIN supports the Local Interconnect standard 2.0 and can be used as a UART in full-duplex mode using the standard Non-Return-to-Zero (NRZ) format.

The DCAN supports the CAN 2.0 (A and B) protocol standard and uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 Mbps. The DCAN is ideal for systems operating in noisy and harsh environments (for example, automotive vehicle networking and industrial fieldbus) that require reliable serial communication or multiplexed wiring.

The I2C module is a multimaster communication module providing an interface between the microcontroller and an I2C-compatible device via the I2C serial bus. The I2C supports speeds of 100 and 400 Kbps.

The frequency-modulated phase-locked loop (FMPLL) clock module is used to multiply the external frequency reference to a higher frequency for internal use. There are two FMPLL modules on this device. These modules, when enabled, provide two of the seven possible clock source inputs to the global clock module (GCM). The GCM manages the mapping between the available clock sources and the device clock domains.

The device also has an external clock prescaler (ECP) module that when enabled, outputs a continuous external clock on the ECLK pin/ball. The ECLK frequency is a user-programmable ratio of the peripheral interface clock (VCLK) frequency. This low-frequency output can be monitored externally as an indicator of the device operating frequency.

The DMA controller has 16 channels, 32 control packets and parity protection on its memory. An MPU is built into the DMA to limit the DMA to prescribed areas of memory and to protect the rest of the memory system from any malfunction of the DMA.

The Error Signaling Module (ESM) monitors all device errors and determines whether an interrupt is generated or the external ERROR pin is toggled when a fault is detected. The ERROR pin can be monitored externally as an indicator of a fault condition in the microcontroller.

The External Memory Interface (EMIF) provides off-chip expansion capability with the ability to interface to synchronous DRAM (SDRAM) devices, asynchronous memories, peripherals or FPGA devices.

Several interfaces are implemented to enhance the debugging capabilities of application code. In addition to the built in ARM Cortex-R4F CoreSight debug features an External Trace Macrocell (ETM) provides instruction and data trace of program execution. For instrumentation purposes, a RAM Trace Port (RTP) module is implemented to support high-speed tracing of RAM and peripheral accesses by the CPU or any other master. A Data Modification Module (DMM) gives the ability to write external data into the device memory. Both the RTP and DMM have no or only minimum impact on the program execution time of the application code. A Parameter Overlay Module (POM) can reroute flash accesses to internal memory or to the EMIF. This rerouting allows parameters and tables to be dynamically calibrated against production code without rebuilding the code to explicitly access RAM or halting the processor to reprogram the data flash.

With integrated safety features and a wide choice of communication and control peripherals, the device is an ideal solution for high-performance real-time control applications with safety-critical requirements.

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33개 모두 보기
유형 직함 날짜
* Data sheet TMS570LS3137-EP 16- and 32-Bit RISC Flash Microcontroller datasheet (Rev. D) PDF | HTML 2015/02/20
* Errata TMS570LS31x/21x Microcontroller Silicon Errata (Silicon Revision C) (Rev. G) 2016/05/31
* Errata TMS570LS31x/21x Microcontroller Silicon Errata (Silicon Revision D) (Rev. B) 2016/05/31
* User guide TMS570LS31x/21x 16/32-Bit RISC Flash Microcontroller Technical Reference Manual (Rev. C) 2018/03/01
* VID TMS570LS3137-EP VID V6213629 2016/06/21
* Radiation & reliability report TMS5703137CGWTMEP Reliability Report 2015/02/06
* Radiation & reliability report TMS5703137CGWTQEP Reliability Report 2014/12/22
Selection guide Enhanced Product Selection Guide (Rev. C) PDF | HTML 2021/06/30
More literature Hercules™ Diagnostic Library Test Automation Unit User Guide (Rev. B) PDF | HTML 2020/01/09
More literature HALCoGen-CSP 04.07.01 (Rev. C) PDF | HTML 2020/01/08
Functional safety information HALCoGen-CSP Installation Guide (Rev. B) PDF | HTML 2020/01/08
Functional safety information HALCoGen-CSP User's Guide (Rev. C) PDF | HTML 2020/01/08
Functional safety information Hercules Diagnostic Library -TAU Installation Guide (Rev. B) PDF | HTML 2020/01/08
User guide Hercules Diagnostic Library CSP Without LDRA 2019/10/29
Application note HALCoGen Ethernet Driver With lwIP Integration Demo and Active Webserver Demo PDF | HTML 2019/09/13
Application note CAN Bus Bootloader for Hercules Microcontrollers PDF | HTML 2019/08/21
Application note HALCoGen CSP Without LDRA Release_Notes 2019/08/19
User guide HALCoGen-CSP Without LDRA Installation Guide PDF | HTML 2019/08/19
User guide HALCoGen-CSP Without LDRA User's Guide PDF | HTML 2019/08/19
User guide Hercules Diagnostic Library - Without LDRA Installation Guide PDF | HTML 2019/08/19
User guide Hercules™ Diag Lib Test Automation Unit Without LDRA User's Guide PDF | HTML 2019/08/19
Application note Sharing FEE Blocks Between the Bootloader and the Application 2017/11/07
Application note Sharing Exception Vectors on Hercules™ Based Microcontrollers 2017/03/27
Application note How to Create a HALCoGen Based Project For CCS (Rev. B) 2016/08/09
Application note Using the CRC Module on Hercules™-Based Microcontrollers 2016/08/04
Application note Using the SPI as an Extra UART Transmitter 2016/07/26
Application note High Speed Serial Bus Using the MibSPIP Module on Hercules-Based MCUs 2016/04/22
Application note Triggering ADC Using Internal Timer Events on Hercules MCUs 2015/10/19
Application note Continuous Monitor of the PLL Frequency With the DCC 2015/07/24
Functional safety information Foundational Software for Functional Safety 2015/05/12
Application note Sine Wave Generation Using PWM With Hercules N2HET and HTU 2015/05/12
Application note Triangle/Trapezoid Wave Generation Using PWM With Hercules N2HET 2015/05/01
Application note Hercules SCI With DMA 2015/03/22

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NFBGA (GWT) 337 Ultra Librarian

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포함된 정보:
  • RoHS
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  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
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TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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