產品詳細資料

Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 800, 1000 Coprocessors GPU CPU 32-bit Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator, SGX Graphics Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 800, 1000 Coprocessors GPU CPU 32-bit Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator, SGX Graphics Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
FCCSP (CBC) 515 196 mm² 14 x 14 FCCSP (CBP) 515 144 mm² 12 x 12 FCCSP (CUS) 423 256 mm² 16 x 16
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

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Limited design support from TI available

This product has limited design support from TI for existing projects. If available, you will find relevant collateral, software and tools in the product folder. For existing designs using this product, you can request support in the TI E2ETM support forums, but limited support is available for this product.

技術文件

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類型 標題 日期
* Data sheet DM3730, DM3725 Digital Media Processors datasheet (Rev. D) 2011年 4月 11日
* Errata DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F) 2014年 2月 13日
* User guide AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 2012年 9月 24日
Application note OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles 2019年 3月 20日
Technical article Enabling Wi-Fi® and Bluetooth® connectivity on RTOS PDF | HTML 2016年 4月 13日
Technical article Spring has sprung. A sale has sprung. PDF | HTML 2016年 4月 4日
Application note Plastic Ball Grid Array [PBGA] Application Note (Rev. B) 2015年 8月 13日
Technical article Selecting the right processor: WiLink 8 plug and play platforms PDF | HTML 2015年 6月 26日
Application note PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) 2013年 11月 1日
User guide Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 2012年 9月 10日
More literature DM37x Design Network Partners 2012年 6月 5日
Application note TI OMAP4430 POP SMT Design Guideline (Rev. C) 2011年 11月 3日
Application note Introduction to TMS320C6000 DSP Optimization 2011年 10月 6日
Application note PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs 2011年 6月 15日
Product overview DM3730 Product Bulletin 2010年 9月 7日
Application note PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 2010年 6月 23日
Application note PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 2010年 6月 23日
Application note AM/DM37x Power Estimation Spreadsheet 2010年 6月 7日
Application note AM/DM37x Overview 2010年 6月 3日
Application note AM3715/03 Memory Subsystem 2010年 6月 3日
Application note AM37x CUS Routing Guidelines 2010年 6月 3日
Application note Setting up AM37x SDRC Registers 2010年 6月 3日
User guide Flip Chip Ball Grid Array Package Reference Guide (Rev. A) 2005年 5月 23日
Application note AN-1281 Bumped Die (Flip Chip) Packages (Rev. A) 2004年 5月 1日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

軟體開發套件 (SDK)

ANDROIDEVKIT-FROYO Android FROYO - Dev Kit for DM37x (TI_Android_DevKit/02_02_00)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

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產品
Arm 式處理器
DM3725 數位媒體處理器 DM3730 數位媒體處理器
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軟體開發套件 (SDK)

ANDROIDEVKIT-GINGERBREAD Android GINGERBREAD 2.3 - Dev Kit for DM37x (TI_Android_GingerBread_2_3_DevKit_1_0)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

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產品
Arm 式處理器
DM3725 數位媒體處理器 DM3730 數位媒體處理器
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軟體開發套件 (SDK)

LINUXDVSDK-DM37X — 用於 DM3730/3725 數位媒體處理器的 Linux 數位視訊軟體開發套件 (DVSDK)

The Linux Digital Video Software Development Kit (DVSDK) for DaVinci™ processors provides everything developers need to evaluate and start developing on the DM37x Cortex™-A8 DSP+ARM® microprocessors. With the included Graphical User Interface (GUI)-based Matrix Application Launcher, launching (...)
驅動程式或資料庫

TELECOMLIB — 電信和媒體庫 - 用於 TMS320C64x+ 和 TMS320C55x 處理器的 FAXLIB、VoLIB 和 AEC/AER

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)
IDE、配置、編譯器或偵錯程式

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® desktops. It can also (...)

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軟體程式設計工具

FLASHTOOL FlashTool for AM35x, AM37x, DM37x and OMAP35x Devices

Flash Tool is a Windows-based application that can be used to transfer binary images from a host PC to TI Sitara AM35x, AM37x, DM37x and OMAP35x target platforms.


Additional Information:

TI GForge - Welcome to gforge.ti.com

TI E2E Community

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產品
Arm 式處理器
AM3505 Sitara 處理器:Arm Cortex-A8、視訊前端 AM3517 Sitara 處理器:ARM Cortex-A8、3D 圖形、視訊前端 AM3703 Sitara 處理器:Arm Cortex-A8、攝影機 AM3715 Sitara 處理器:ARM Cortex-A8、3D 圖形、攝影機 DM3725 數位媒體處理器 DM3730 數位媒體處理器 OMAP3503 Sitara 處理器:Arm Cortex-A8,LPDDR OMAP3515 Sitara 處理器:ARM Cortex-A8、3D 圖形、LPDDR OMAP3525 應用處理器 OMAP3530 應用處理器
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模擬型號

AM/DM37x CBC BSDL Model (Rev. B)

SPRM507B.ZIP (8 KB) - BSDL Model
模擬型號

AM/DM37x CBC IBIS Model

SPRM510.ZIP (4410 KB) - IBIS Model
模擬型號

AM/DM37x CBP BSDL Model

SPRM506.ZIP (9 KB) - BSDL Model
模擬型號

AM/DM37x CBP IBIS Model

SPRM509.ZIP (4408 KB) - IBIS Model
模擬型號

AM/DM37x CUS BSDL Model

SPRM508.ZIP (10 KB) - BSDL Model
模擬型號

AM/DM37x CUS IBIS Model

SPRM511.ZIP (4255 KB) - IBIS Model
參考設計

TIDA-00408 — 適用於建築自動化與醫療應用的觸覺回饋電容式觸控顯示器參考設計

The TIDA-00408 Touch Display with Haptic Feedback reference design showcases haptics for thermostats, building automation, factory automation, point of sale, and automotive applications.  The touch screen provides touch feedback when the user interacts with the on-screen user interface.  (...)
Design guide: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
FCCSP (CBC) 515 Ultra Librarian
FCCSP (CBP) 515 Ultra Librarian
FCCSP (CUS) 423 Ultra Librarian

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  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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